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STM32F401VBH3 Overview

The STM32F401xB/STM32F401xC devices are based on the high-performance Arm® Cortex® -M4 32-bit RISC core operating at a frequency of up to 84 MHz. The Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

The STM32F401xB/STM32F401xC incorporate high-speed embedded memories (up to 256 Kbytes of Flash memory, up to 64 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses and a 32-bit multi-AHB bus matrix.
All devices offer one 12-bit ADC, a low-power RTC, six general-purpose 16-bit timers including one PWM timer for motor control, two general-purpose 32-bit timers. They also feature standard and advanced communication interfaces.
The STM32F401xB/STM32F401xC operate in the - 40 to + 125 °C temperature range from a 1.7 (PDR OFF) to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications.
These features make the STM32F401xB/STM32F401xC microcontrollers suitable for a wide range of applications.


  • 1.7 V to 3.6 V power supply
  • -40 °C to 85/105/125 °C temperature range
  • Core: Arm 32-bit Cortex-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator) allowing 0-wait state execution from Flash memory, frequency up to 84 MHz, memory protection unit, 105 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
  • Memories
    • Up to 256 Kbytes of Flash memory
    • 512 bytes of OTP memory
    • Up to 64 Kbytes of SRAM
  • Clock, reset and supply management
    • 1.7 V to 3.6 V application supply and I/Os
    • POR, PDR, PVD and BOR
    • 4-to-26 MHz crystal oscillator
    • Internal 16 MHz factory-trimmed RC
    • 32 kHz oscillator for RTC with calibration
    • Internal 32 kHz RC with calibration
  • Power consumption
    • Run: 128 μA/MHz (peripheral off)
    • Stop (Flash in Stop mode, fast wakeup time): 42 μA typ @ 25 °C;65 μA max @25 °C
    • Stop (Flash in Deep power down mode, slow wakeup time): down to 10 μA typ@ 25 °C; 28 μA max @25 °C
    • Standby: 2.4 μA @25 °C / 1.7 V without RTC; 12 μA @85 °C @1.7 V
    • VBAT supply for RTC: 1 μA @25 °C
  • 1×12-bit, 2.4 MSPS A/D converter: up to 16 channels
  • General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support
  • Up to 11 timers: up to six 16-bit, two 32-bit timers up to 84 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window) and a SysTick timer
  • Applications



    • Core Processor ARM Cortex M4

    • Speed 84MHz

    • Operating Temperature -40℃ ~ 125℃ (TA)

    • Program Memory Type FLASH

    • RAM Size 64K x 8

    • Number of I/O 50

    • Peripherals Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT

    • Mounting Type Surface Mount

    • Oscillator Type Internal

    • Supplier Device Package 100-UFBGA (7x7)

    • Package / Case 100-UFBGA

    • Core Size 32-Bit

    • Connectivity I2C, IrDA, LINbus, SDIO, SPI, UART/USART, USB OTG

    • Program Memory Size 128KB (128K x 8)

    • Data Converters A/D 16x12b

    • Voltage - Supply (Vcc/Vdd) 1.7V ~ 3.6V

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