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SPC564A80B4CFBY

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SPC564A80B4CFBY Overview

The microcontroller’s e200z4 host processor core is built on Power Architecture technology and designed specifically for embedded applications. In addition to the Power Architecture technology, this core supports instructions for digital signal processing (DSP).

Features

  • Variable length instruction encoding (VLE)
  • Superscalar architecture with 2 execution units
  • Up to 2 integer or floating point instructions per cycle
  • Up to 4 multiply and accumulate operations per cycle
  • Memory organization
    • 4 MB on-chip flash memory with ECC and Read While Write (RWW)
    • 192 KB on-chip RAM with standby functionality (32 KB) and ECC
    • 8 KB instruction cache (with line locking), configurable as 2- or 4-way
    • 14 + 3 KB eTPU code and data RAM
    • 5 × 4 crossbar switch (XBAR)
    • 24-entry MMU
    • External Bus Interface (EBI) with slave and master port
  • Fail Safe Protection
    • 16-entry Memory Protection Unit (MPU)
    • CRC unit with 3 sub-modules
    • Junction temperature sensor
  • Interrupts
    • Configurable interrupt controller (with NMI)
    • 64-channel DMA
  • Serial channels
    • 3 × eSCI
    • 3 × DSPI (2 of which support downstream Micro Second Channel [MSC])
    • 3 × FlexCAN with 64 messages each
    • 1 × FlexRay module (V2.1) up to 10 Mbit/s with dual or single channel and 128 message objects and ECC
  • 1 × eMIOS
    • 24 unified channels
  • 1 × eTPU2 (second generation eTPU)
    • 32 standard channels
    • 1 × reaction module (6 channels with three outputs per channel)
  • 2 enhanced queued analog-to-digital converters (eQADCs)
    • Forty 12-bit input channels (multiplexed on 2 ADCs); expandable to 56 channels with external multiplexers
    • 6 command queues
    • Trigger and DMA support
    • 688 ns minimum conversion time
  • On-chip CAN/SCI/FlexRay Bootstrap loader with Boot Assist Module (BAM)
  • Applications

    SPC56

    Specifications

    • Core Processor e200z4

    • Speed 120MHz

    • Operating Temperature -40℃ ~ 125℃ (TA)

    • Program Memory Type FLASH

    • RAM Size 192K x 8

    • Number of I/O 190

    • Peripherals DMA, POR, PWM, WDT

    • Mounting Type Surface Mount

    • Oscillator Type Internal

    • Supplier Device Package 324-PBGA (23x23)

    • Package / Case 324-BGA

    • Core Size 32-Bit

    • Connectivity CANbus, EBI/EMI, LINbus, SCI, SPI

    • Program Memory Size 4MB (4M x 8)

    • Data Converters A/D 40x12b

    • Voltage - Supply (Vcc/Vdd) 1.14V ~ 1.32V

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