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Home > Embedded ICs > Embedded - Digital Signal Processors & Controllers (DSP, DSC) > MSC8154ETVT1000B
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MSC8154ETVT1000B

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MSC8154ETVT1000B Overview

The MSC8154E device is one of Our fourth-generation high-end multicore DSP devices that target broadband wireless base stations and other communications infrastructure with security processing. The MSC8154E is a four-core DSP based on NXP’s SC3850 StarCore® technology and designed to advance the capabilities of wireless broadband equipment. It delivers industry-leading performance and power savings, leveraging 45 nm process technology in a highly integrated system-on-chip (SoC) to provide performance equivalent to a 4 GHz single-core device. The MSC8154E helps equipment manufacturers and carriers create solutions and services that enable near-term, mainstream adoption of next-generation wireless standards such as 3G-LTE, WiMAX, HSPA+ and TDD-LTE. The device is designed to lower system costs by integrating functionality into a single device that previously required multiple discrete parts.

The MSC8154E DSP delivers a high level of performance and integration, combining four fully programmable new and enhanced SC3850 DSP cores, each running at up to 1 GHz with an architecture highly optimized for wireless infrastructure applications. Developed by NXP® and integrated on-chip, the MAPLE-B baseband accelerator supports hardware acceleration for Turbo and Viterbi channel decoding and for DFT/iDFT and FFT/iFFT algorithms and includes CRC processing. An internal RISC-based QUICC Engine® subsystem supports multiple networking protocols to guarantee reliable data transport over packet networks while significantly offloading processing from the DSP cores.

The MSC8154E embeds large internal memory and supports a variety of advanced, high-speed interface types, including two RapidIO® interfaces, two gigabit Ethernet interfaces for network communications, a PCI Express® controller, two DDR controllers for high-speed, industry standard memory interface, four multi-channel TDM interfaces and a security encryption/decryption processor (SEC).

Features

  • Four StarCore® DSP SC3850 core subsystems operating at up to 1 GHz/8000 MMACS per core and up to 32000 MMACS per device
  • Multi accelerator platform engine for baseband (MAPLE-B)
  • High-speed, high-bandwidth CLASS fabric arbitrates between the DSP cores and other CLASS masters to M2 memory, M3 memory, DDR controllers, MAPLE-B and the configuration registers
  • Two DDR controllers with up to 400 MHz clock (800 MHz data) rate and 32/64-bit DDR2/3 SDRAM data bus
  • Dual RISC core QUICC Engine® subsystem operating at up to 500 MHz provides parallel packet processing independent of the DSP cores
  • HSSI that supports two 4x SerDes ports
  • Security engine core (SEC) optimized to process all the cryptographic algorithms associated with IPSec, IKE, SSL/TLS, 3GPP and LTE
  • Four TDM interfaces
  • UART and I²C interfaces
  • Eight software watchdog timers
  • Sixteen 16-bit timers, two 32-bit general purpose timers per core for RTOS support
  • I/O interrupt concentrator and virtual interrupt support, eight hardware semaphores
  • Thirty-two GPIO ports multiplexed with interface signals and IRQ inputs
  • Boot options: Ethernet, Serial RapidIO, I²C and serial peripheral interface (SPI)
  • Three input clocks and five PLLs
  • JTAG Test Access Port (TAP) and boundary scan architecture designed to comply with IEEE® Std. 1149.1 profiling and performance monitoring support
  • Reduced power dissipation with wait, stop and power down low-power standby modes
  • Optimized power management circuitry
  • CMOS 45 nm SOI technology in 29 mm x 29 mm, 783 ball FC-PBGA package

Applications

StarCore

Specifications

  • Clock Rate 1GHz

  • Operating Temperature -40℃ ~ 105℃ (TJ)

  • Type SC3850 Quad Core

  • Non-Volatile Memory ROM (96 kB)

  • Package / Case 783-BBGA, FCBGA

  • Voltage - Core 1.00V

  • Voltage - I/O 2.50V

  • Mounting Type Surface Mount

  • Interface Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART

  • Supplier Device Package 783-FCPBGA (29x29)

  • On-Chip RAM 576kB

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