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NXP

MCP11A1CFNE3R

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Applications

HC11

Specifications

  • Core Processor HC11

  • Speed 3MHz

  • Operating Temperature -40℃ ~ 85℃ (TA)

  • Program Memory Type ROMless

  • RAM Size 256 x 8

  • Number of I/O 38

  • Peripherals POR, WDT

  • Mounting Type Surface Mount

  • Oscillator Type External

  • Supplier Device Package 52-PLCC (19.1x19.1)

  • EEPROM Size 512 x 8

  • Package / Case 52-LCC (J-Lead)

  • Core Size 8-Bit

  • Connectivity SCI, SPI

  • Data Converters A/D 8x8b

  • Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V

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