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Home > Embedded ICs > Embedded - System On Chip (SoC) > M2S060-FCS325
Microsemi

M2S060-FCS325

M2S060-FCS325

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Features

  • ARM Cortex-M3 processor with up to 166 MHz system clock frequency
  • 60,000 logic elements (LEs) in the programmable logic fabric
  • 2,420 kbits of embedded memory
  • 5,160 kbits of flash memory
  • 128 kbits of eNVM (embedded non-volatile memory)
  • 32 kbits of eSRAM (embedded SRAM)
  • DDR2, DDR3, and LPDDR memory interfaces
  • 18x 5G SERDES (serializer/deserializer) channels
  • High-speed I/O interfaces, including PCIe, XAUI, and SGMII
  • 128-bit AES decryption in hardware
  • Built-in cryptographic services (e.g., RSA, ECC, and SHA)
  • FlashLock for secure configuration management
  • FCS325 package (Fine-Pitch Ceramic Column Grid Array)

Applications

  • Industrial automation and control
  • Communications infrastructure
  • Medical and scientific instrumentation
  • Aerospace and defense systems
  • Security and surveillance
  • Networking equipment
  • Embedded systems

Specifications

  • Core Processor ARM Cortex M3

  • Speed 166MHz

  • Operating Temperature 0℃ ~ 85℃ (TJ)

  • Architecture MCU, FPGA

  • Package / Case 325-TFBGA, CSPBGA

  • Flash Size 256KB

  • RAM Size 64KB

  • Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB

  • Peripherals DDR, PCIe, SERDES

  • Primary Attributes FPGA - 60K Logic Modules

  • Supplier Device Package 325-CSPBGA (11x11)

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