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LPC43S30FET100E

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LPC43S30FET100E Overview

The LPC43S30FET100 is a Arm Cortex-M4 based microcontroller for embeddedapplications which includes an Arm Cortex-M0 coprocessor, 264 kB of SRAM,security features with AES engine, advanced configurable peripherals such as the StateConfigurable Timer/PWM (SCTimer/PWM) and the Serial General-Purpose I/O (SGPIO)interface, two High-speed USB controllers, Ethernet,an external memory controller,and multiple digital and analog peripherals. The LPC43S30FET100 operates at CPUfrequencies of up to 204 MHz.

The Arm Cortex-M4 is a 32-bit core that offers system enhancements such as low power consumption,enhanced debug features, and a high level of support block integration. The Arm Cortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture with separatelocal instruction and data buses as well as a third bus for peripherals, and includes aninternal prefetch unit that supports speculative branching. The Arm Cortex-M4 supportssingle-cycle digital signal processing and SIMD instructions. A hardware floating-pointunit is integrated in the core.

The Arm Cortex-M0 coprocessor is an energy-efficient and easy-to-use 32-bit core which is code-and tool-compatible with the Cortex-M4 core. The Cortex-M0 coprocessor offers up to 204MHz performance with a simple instruction set and reduced code size. In LPC43Sx0, theCortex-M0 coprocessor hardware multiply is implemented as a 32-cycle iterativemultiplier.

Features

  • Cortex-M4 Processor core
    • Arm Cortex-M4 processor, running at frequencies of up to 204 MHz.
    • Built-in Memory Protection Unit (MPU) supporting eight regions.
    • Built-in Nested Vectored Interrupt Controller (NVIC).
    • Hardware floating-point unit making the core a Cortex-M4.
    • Non-maskable Interrupt (NMI) input.
    • JTAG and Serial Wire Debug (SWD), serial trace, eight breakpoints, and four watchpoints.
    • Enhanced Trace Module (ETM) and Enhanced Trace Buffer (ETB) support.
    • System tick timer.
  • Cortex-M0 Processor core
    • Arm Cortex-M0 coprocessor capable of off-loading the main Arm Cortex-M4Fapplication processor.
    • Running at frequencies of up to 204 MHz.
    • JTAG
    • Built-in NVIC.
  • On-chip memory
    • 264 kB SRAM for code and data use.
    • Multiple SRAM blocks with separate bus access. Two SRAM blocks can be powered down individually
    • 64 kB ROM containing boot code and on-chip software drivers.
    • 64 bit general-purpose OTP memory
    • Two banks (256 bit total) One-Time Programmable (OTP) memory for AES keystorage One bank can store an encrypted key for decoding the boot image.
  • AES engine for encryption and decryption of the boot image and data with DMAsupport and programmable via a ROM-based API.
  • Clock generation unit
    • Crystal oscillator with an operating range of 1 MHz to 25 MHz.
    • 12 MHz Internal RC (IRC) oscillator trimmed to 1.5 % accuracy over temperatureand voltage.
    • Ultra-low power Real-Time Clock (RTC) crystal oscillator.
    • Three PLLs allow CPU operation up to the maximum CPU rate without the need fora high-frequency crystal. The second PLL is dedicated to the High-speed USB, thethird PLL can be used as audio PLL.
    • Clock output.
  • Configurable digital peripherals
    • Serial GPIO (SGPIO) interface.
    • State Configurable Timer (SCTimer/PWM) subsystem on AHB.
    • Global Input Multiplexer Array (GIMA) allows to cross-connect multiple inputs andoutputs to event driven peripherals like the timers, SCTimer/PWM, and ADC0/1.
  • Serial interfaces
    • Quad SPI Flash Interface (SPIFI) with 1-, 2-, or 4-bit data at rates of up to52 MB per second.
    • 10/100T Ethernet MAC with RMII and MII interfaces and DMA support for highthroughput at low CPU load. Support for IEEE 1588 time stamping/advanced timestamping (IEEE 1588-2008 v2).
    • One High-speed USB 2.0 Host/Device/OTG interface with DMA support andon-chip high-speed PHY (USB0).
    • One High-speed USB 2.0 Host/Device interface with DMA support, on-chipfull-speed PHY and ULPI interface to external high-speed PHY (USB1).
    • USB interface electrical test software included in ROM USB stack.
    • Four 550 UARTs with DMA support: one UART with full modem interface; oneUART with IrDA interface; three USARTs support UART synchronous mode and asmart card interface conforming to ISO7816 specification.
    • Up to two C_CAN 2.0B controllers with one channel each. Use of C_CAN controllerexcludes operation of all other peripherals connected to the same bus bridge
    • Two SSP controllers with FIFO and multi-protocol support. Both SSPs with DMAsupport.
    • One SPI controller.
    • One Fast-mode Plus I²C-bus interface with monitor mode and with open-drain I/Opins conforming to the full I²C-bus specification. Supports data rates of up to1 Mbit/s.
    • One standard I²C-bus interface with monitor mode and with standard I/O pins.
    • Two I²S interfaces, each with DMA support and with one input and one output.
  • Digital peripherals
    • External Memory Controller (EMC) supporting external SRAM, ROM, NOR flash,and SDRAM devices.
    • Secure Digital Input Output (SD/MMC) card interface.
    • Eight-channel General-Purpose DMA controller can access all memories on theAHB and all DMA-capable AHB slaves.
    • Up to 49 General-Purpose Input/Output (GPIO) pins with configurablepull-up/pull-down resistors.
    • GPIO registers are located on the AHB for fast access. GPIO ports have DMAsupport.
    • Up to eight GPIO pins can be selected from all GPIO pins as edge and levelsensitive interrupt sources.
    • Two GPIO group interrupt modules enable an interrupt based on a programmablepattern of input states of a group of GPIO pins.
    • Four general-purpose timer/counters with capture and match capabilities.
    • Repetitive Interrupt timer (RI timer).
    • Windowed watchdog timer (WWDT).
    • Ultra-low power Real-Time Clock (RTC) on separate power domain with 256 bytesof battery powered backup registers.
    • Alarm timer; can be battery powered.
  • Analog peripherals
    • One 10-bit DAC with DMA support and a data conversion rate of 400 kSamples/s.
    • Two 10-bit ADCs with DMA support and a data conversion rate of 400 kSamples/s.Up to eight input channels per ADC.
  • Unique ID for each device.
  • Power
    • Single 3.3 V (2.2 V to 3.6 V) power supply with on-chip internal voltage regulator forthe core supply and the RTC power domain.
    • RTC power domain can be powered separately by a 3 V battery supply.
    • Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deeppower-down.
    • Processor wake-up from Sleep mode via wake-up interrupts from variousperipherals.
    • Wake-up from Deep-sleep, Power-down, and Deep power-down modes viaexternal interrupts and interrupts generated by battery powered blocks in the RTCpower domain.
    • Brownout detect with four separate thresholds for interrupt and forced reset.
    • Power-On Reset (POR).
    • Available as TFBGA100 package.
Target Applications
  • Communication hubs
  • Automotive aftermarket
  • Power management
  • Consumer health devices
  • Embedded audio applications
  • Industrial control
  • Industrial automation
  • White goods

Applications

LPC43xx

Specifications

  • Core Processor ARM Cortex M4/M0

  • Speed 204MHz

  • Operating Temperature -40℃ ~ 85℃ (TA)

  • Program Memory Type ROMless

  • RAM Size 264K x 8

  • Number of I/O 49

  • Peripherals Brown-out Detect/Reset, DMA, I2S, POR, WDT

  • Mounting Type Surface Mount

  • Oscillator Type Internal

  • Supplier Device Package 100-TFBGA (9x9)

  • Package / Case 100-TFBGA

  • Core Size 32-Bit Dual-Core

  • Connectivity CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG

  • Data Converters A/D 4x10b; D/A 1x10b

  • Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V

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