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BCM5482SA1KFB

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BCM5482SA1KFB Overview

A member of Broadcom's third generation of Gigabit Ethernet PHYs, the BCM5482 consists of two complete 10/100/1000BASE-T Gigabit Ethernet transceivers integrated on a single monolithic CMOS chip. The BCM5482 is optimized for low power and small footprint size to reduce design complexity for space-constrained IP phone applications. For 10/ 100BASE-TX applications, the single package offers a compelling advantage over two single devices for Gigabit uplinks. 

The BCM5482 DSP-based architecture and advanced power management techniques combine to achieve robust and low-power operation over existing Category 5 twisted-pair wiring. The BCM5482 architecture not only meets the requirements of IEEE 802.3, IEEE 802.3u, and IEEE 802.3ab, but also maintains the industry’s highest level of margin over IEEE requirements for echo, near-end crosstalk (NEXT), and far-end crosstalk (FEXT). With the industry's lowest power at 600 mW per port, the BCM5482 assists in reducing the power distribution requirements of IP phone systems. In addition, the BCM5482 has extremely low EMI emissions, which reduces the design constraints required to meet EMI radiation specifications.

Features

• Dual-port integrated 10BASE-T/100BASE-TX/1000BASE-T Gigabit Ethernet transceiver .

• RGMII, SGMII, and SerDes MAC interface options.

• 1-Gbps line-side SerDes with RGMII MAC interface.

• Fully compliant with IEEE 802.3, IEEE 802.3u, and  IEEE 802.3ab standards.

• 0.13-micron CMOS—low power and cost.

• Supports copper or fiber in RGMII mode.

• Low power.

• 600 mW per port.

• Advanced power management.

• Trace-matched output impedance.

• Line-side and MAC-side loopback.

• Low EMI emissions.

• CableChecker™ Diagnostics.

• Cable plant analyzer function detects cable plant impairments.

• Ethernet@WireSpeed.

• Automatic MDI/MDIX crossover at all speeds.

• Robust cable-sourced electrostatic discharge (CESD) tolerance.

• Support for jumbo packets up to 10 kB.

• IEEE 1149.1 (JTAG) boundary scan.

• 121-pin BGA package.

Specifications

  • Package Type 121 BGA

  • I temp Y

  • Package Size(mm) 12x12

  • Description 2 ports GE PHY

  • Process 130nm

  • Power rails 2.5V/3.3V

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