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ADSP-BF533SBBZ400

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ADSP-BF533SBBZ400 Overview

The ADSP-BF533 provides a high performance, power-efficient processor choice for today's most demanding convergent signal processing applications.The high performance 16-bit/32-bit Blackfin® embedded processor core, the flexible cache architecture, the enhanced DMA subsystem, and the dynamic power management (DPM) functionality allow system designers a flexible platform to address a wide range of applications including consumer,communications, automotive, and industrial/instrumentation.

Architectural Features

  • High performance 16-bit/32-bit embedded processor core
  • 10-stage RISC MCU/DSP pipeline with mixed 16-bit/32-bit ISA for optimal code density
  • Full SIMD architecture, including instructions for accelerated video and image processing
  • Memory management unit (MMU) supporting full memory protection for an isolated and secure environment

High Level of Integration

  • Up to 148 kB of on-chip SRAM
  • Glueless video capture and display port
  • Two dual-channel, full-duplex, synchronous serial ports supporting eight stereo I2S channels
  • 12 DMA channels supporting one- and two-dimensional data transfers
  • Memory controller providing glueless connection to multiple banks of external SDRAM, SRAM, Flash, or ROM
  • 160-ball mini-BGA, 169-ball PBGA packages
  • Industrial temperature ranges (40°C to 85°C) and commercial temperature ranges (0°C to 70°C) available

Features

  • Application-tuned peripherals provide glueless connectivity to general-purpose converters in data acquisition applications
  • Large on-chip SRAM for maximum system performance

Applications

Blackfin?

Specifications

  • Clock Rate 400MHz

  • Operating Temperature -40℃ ~ 85℃ (TA)

  • Type Fixed Point

  • Non-Volatile Memory ROM (1 kB)

  • Package / Case 169-BBGA

  • Voltage - Core 1.20V

  • Voltage - I/O 3.30V

  • Mounting Type Surface Mount

  • Interface SPI, SSP, UART

  • Supplier Device Package 169-PBGA (19x19)

  • On-Chip RAM 148kB

Circuit Diagram

ADSP-BF533

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