ADSP-BF526KBCZ-3 Analog Devices DSP

ADSP-BF526KBCZ-3 Overview

With the combination of peripherals which enable glue-less connectivity to networked devices such as Ethernet or WiFi 802.11 a/b/g modules and power efficient signal processing, the ADSP-BF526 is well suited to IP connected applications such as VoIP Phone or IP Camera.

The VoIP challenge to the embedded-system designer is to choose a processing solution that is cost-effective, easy to deploy and scaleable in performance across market spaces. A “sweet spot” embedded-solution approach is to design with a platform that can implement a low channel count basic VoIP solution, yet retain sufficient capacity for value added capabilities and services – such as video, music, imaging and system control. Unlike traditional VoIP embedded solutions that utilize two processor cores to provide VoIP functionality, the ADSP-BF526 provides a convergent solution in a unified core architecture that allows voice and video signal processing concurrent with RISC MCU processing to handle network and user-interface demands. This unique ability to offer full VoIP functionality on a single convergent processor provides for a unified software development environment, faster system debugging and deployment, and lower overall system cost.

IP protection has become a necessary part of today’s embedded computing applications. The ADSP-BF526 provides a security scheme which balances flexibility and upgradeability with performance through the inclusion of a firmware-based solution including OTP (One Time Programmable) memory to enable users to implement private keys for secure access to program code.

ECAD Model

Footprint

Features

: Hardware-enabled security for code and content protection.
Blackfin Processor Core with up to 400 MHz (800 MMACS) performance
2 dual-channel, full-duplex synchronous serial ports supporting 8 stereo I2S channels
12 peripheral DMA channels supporting one- and two-dimensional data transfers
NAND Flash Controller with 8-Bit interface for commands, addresses and data.

Ethernet 10/100 MII interface
Memory controller providing glue-less connection to multiple banks of external SDRAM, SRAM, Flash, or ROM
Low Standby Power; ~1mA Deep Sleep, ~50uA Hibernate
289-ball, 12x12 mm, 0.5 mm pitch mini-BGA (Commercial temperature range 0°C to +70°C)
208-ball, 17x17 mm, 0.8 mm pitch mini-BGA (Commercial temperature range 0°C to +70°C; Industrial temperature range -40°C to +85°C)