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Samsung

Samsung Group

Samsung Electro-Mechanics (SEMCO), established in 1973, is a leading developer and manufacturer of a broad range of electronic components. Samsung Electro-Mechanics provides chip parts, communication modules and boards, and optical components to meet the challenges of next-generation designs.

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Featured Products

  • S3C2412XL-26
    S3C2412XL-26

    Categories : Controller

    Package/Case : BGA

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  • K6X4008CIF-GF55
    K6X4008CIF-GF55

    Categories : null

    Package/Case : SOP-32

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  • S3C2443XL-40
    S3C2443XL-40

    Categories : Controller

    Package/Case : BGA

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  • S3C2800X01-EE80
    S3C2800X01-EE80

    Categories : Controller

    Package/Case : QFP208

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  • KA3883
    KA3883

    Categories : Controller

    Package/Case : DIP-8

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  • K4N56163QG-ZC25
    K4N56163QG-ZC25

    Categories : null

    Package/Case : BGA-84

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  • K9WBG08U1M-PIB0
    K9WBG08U1M-PIB0

    Categories :

    Package/Case : TSOP-48

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  • K9F5608U0D-PCB0
    K9F5608U0D-PCB0

    Categories : Memory

    Package/Case : TSOP-48

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  • K6X1008C2D-GF55
    K6X1008C2D-GF55

    Categories : SRAM

    Package/Case : SOP-32

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  • K4J10324KE-HC14
    K4J10324KE-HC14

    Categories : null

    Package/Case : 136FBGA

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  • K9WAG08U1A-PIBO
    K9WAG08U1A-PIBO

    Categories : null

    Package/Case : TSSOP4

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  • K9F4G08U0B-PIB0
    K9F4G08U0B-PIB0

    Categories : Memory

    Package/Case : TSOP48

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  • K9F4G08U0B-PCB0
    K9F4G08U0B-PCB0

    Categories : Memory

    Package/Case : TSOP48

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  • KM29W32000ATS
    KM29W32000ATS

    Categories : null

    Package/Case : TSOP40

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  • K4S281632I-UC75
    K4S281632I-UC75

    Categories : Memory

    Package/Case : TSOP-54

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  • KM4164B-12
    KM4164B-12

    Categories : Memory

    Package/Case : DIP-16

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  • S3F9454BZZ-DKB4
    S3F9454BZZ-DKB4

    Categories : Controller

    Package/Case : DIP-20

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  • S3F9488XZZ-QZ88
    S3F9488XZZ-QZ88

    Categories : Controller

    Package/Case : QFP44

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  • K9F3208W0A-TCB0
    K9F3208W0A-TCB0

    Categories : null

    Package/Case : TSOP48

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  • K9LBG08U0M-PCB0
    K9LBG08U0M-PCB0

    Categories : Memory

    Package/Case : TSSOP-48

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Samsung's mobile chip division is going through an important transition period, because the next-generation Exynos series will be replaced with a standard ARM core from an internally developed custom core. According to reports, the director of Samsung’s China R&D Center today confirmed Samsung’s first chipset to achieve this change.... [Details]

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