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NXP RF Airfast multi-chip module accelerates NEC to achieve MIMO 5G antenna wireless applications

Date: 20-10-2020 ClickCount: 401

NXP Semiconductors and NEC Corporation announced that NEC has selected NXP to provide Rakuten Mobile, Japan's leading mobile network operator, to provide RF Airfast multi-chip modules for massive MIMO 5G antenna radio units (RU).

NEC's massive MIMO 5G antenna RU is equipped with a 5G Open Virtual Radio Access Network (vRAN) interface and has been used by Rakuten Mobile for its fully virtualized cloud-native mobile network. RU uses extremely accurate digital beamforming to achieve high-efficiency and large-capacity transmission, and achieves miniaturization by improving the level of circuit integration, thereby simplifying installation difficulties. RF Airfast

NXP’s new AFSC5G40E38 RF Airfast multi-chip module is specifically developed to meet the frequency and power requirements of Japan’s 5G infrastructure deployment. This device belongs to the NXP RF Airfast multi-chip module portfolio that is being developed and expanded, and is designed to promote the deployment of 5G infrastructure worldwide. NXP's RF Airfast multi-chip module can provide universal packaging for the frequency and power requirements of different regions, thereby helping network mobile operators shorten the time to market.

NEC and Rakuten Mobile use NXP's RF Airfast multi-chip module to jointly develop and manufacture 5G infrastructure.

Kazushi Tsuji, Deputy General Manager of NEC’s Wireless Access Solutions Department, said: “The NXP 5G RF Airfast multi-chip module can support the frequencies and power levels required by Japan’s 5G infrastructure. The flexibility, integration and performance of this technology allow us to Can quickly and effectively develop radio products for 5G infrastructure. We are very pleased to be able to work with Rakuten and NXP to bring 5G experiences to end users."

Paul Hart, executive vice president and general manager of the radio power division of NXP, said: "NXP has been working hard to maintain its leading position in technology. This collaboration highlights our vision to provide advanced 5G experiences to countries around the world. NXP’s Airfast multi-chip modules can Provides a high level of integration, ease of use and performance for 5G infrastructure systems. Suitable for various frequency bands or power levels."

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