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Texas Instruments

TMS320F2808ZGMA

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TMS320F2808ZGMA Overview

The TMS320F2809, TMS320F2808, TMS320F2806, TMS320F2802, TMS320F2801, TMS320F28015, TMS320F28016, TMS320C2802, and TMS320C2801 devices, members of the TMS320C28x DSP generation, are highly integrated, high-performance solutions for demanding control applications.

Throughout this document, TMS320F2809, TMS320F2808, TMS320F2806, TMS320F2802, TMS320F2801, TMS320C2802, TMS320C2801, TMS320F28015, and TMS320F28016 are abbreviated as F2809, F2808, F2806, F2802, F2801, C2802, C2801, F28015, and F28016, respectively. TMS320F28015 and TMS320F28016 are abbreviated as F2801x. Device Comparison (100-MHz Devices) and Device Comparison (60-MHz Devices) provide a summary of features for each device.

Features

  • High-performance static CMOS technology
    • 100 MHz (10-ns cycle time)
    • 60 MHz (16.67-ns cycle time)
    • Low-power (1.8-V core, 3.3-V I/O) design
  • JTAG boundary scan support
    • IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
  • High-performance 32-bit CPU (TMS320C28x)
    • 16 × 16 and 32 × 32 MAC operations
    • 16 × 16 dual MAC
    • Harvard bus architecture
    • Atomic operations
    • Fast interrupt response and processing
    • Unified memory programming model
    • Code-efficient (in C/C++ and Assembly)
  • On-chip memory
    • F2809: 128K × 16 flash, 18K × 16 SARAM
      F2808: 64K × 16 flash, 18K × 16 SARAM
      F2806: 32K × 16 flash, 10K × 16 SARAM
      F2802: 32K × 16 flash, 6K × 16 SARAM
      F2801: 16K × 16 flash, 6K × 16 SARAM
      F2801x: 16K × 16 flash, 6K × 16 SARAM
    • 1K × 16 OTP ROM (flash devices only)
    • C2802: 32K × 16 ROM, 6K × 16 SARAM
      C2801: 16K × 16 ROM, 6K × 16 SARAM
  • Boot ROM (4K × 16)
    • With software boot modes (via SCI, SPI, CAN, I2C, and parallel I/O)
    • Standard math tables
  • Clock and system control
    • On-chip oscillator
    • Watchdog timer module
  • Any GPIO A pin can be connected to one of the three external core interrupts
  • Peripheral Interrupt Expansion (PIE) block that supports all 43 peripheral interrupts
  • Endianness: Little endian
  • 128-bit security key/lock
    • Protects flash/OTP/L0/L1 blocks
    • Prevents firmware reverse-engineering
  • Three 32-bit CPU timers 
  • Enhanced control peripherals
    • Up to 16 PWM outputs
    • Up to 6 HRPWM outputs with 150-ps MEP resolution
    • Up to four capture inputs
    • Up to two quadrature encoder interfaces
    • Up to six 32-bit/six 16-bit timers
  • Serial port peripherals
    • Up to 4 SPI modules
    • Up to 2 SCI (UART) modules
    • Up to 2 CAN modules
    • One Inter-Integrated-Circuit (I2C) bus
  • 12-bit ADC, 16 channels
    • 2 × 8 channel input multiplexer
    • Two sample-and-hold
    • Single/simultaneous conversions
    • Fast conversion rate:
      80 ns - 12.5 MSPS (F2809 only)
      160 ns - 6.25 MSPS (280x)
      267 ns - 3.75 MSPS (F2801x)
    • Internal or external reference
  • Up to 35 individually programmable, multiplexed GPIO pins with input filtering
  • Advanced emulation features
    • Analysis and breakpoint functions
    • Real-time debug via hardware
  • Development support includes
    • ANSI C/C++ compiler/assembler/linker
    • Code Composer Studio IDE
    • SYS/BIOS
    • Digital motor control and digital power software libraries
  • Low-power modes and power savings
    • IDLE, STANDBY, HALT modes supported
    • Disable individual peripheral clocks
  • Package options
    • Thin quad flatpack (PZ)
    • MicroStar BGA (GGM, ZGM)
  • Temperature options
    • A: –40°C to 85°C (PZ, GGM, ZGM)
    • S: –40°C to 125°C (PZ, GGM, ZGM)
    • Q: –40°C to 125°C (PZ)
      (AEC-Q100 qualification for automotive applications)

Applications

C2000? C28x Fixed-Point

Specifications

  • Core Processor C28x

  • Speed 100MHz

  • Operating Temperature -40℃ ~ 85℃ (TA)

  • Program Memory Type FLASH

  • RAM Size 18K x 16

  • Number of I/O 35

  • Peripherals POR, PWM, WDT

  • Mounting Type Surface Mount

  • Oscillator Type Internal

  • Supplier Device Package 100-BGA MICROSTAR (10.1x10.1)

  • Package / Case 100-LFBGA

  • Core Size 32-Bit

  • Connectivity CANbus, I2C, SCI, SPI, UART/USART

  • Program Memory Size 128KB (64K x 16)

  • Data Converters A/D 16x12b

  • Voltage - Supply (Vcc/Vdd) 1.71V ~ 1.89V

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