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Home > Embedded ICs > Embedded - Digital Signal Processors & Controllers (DSP, DSC) > TMS320C28342ZFEQ
Texas Instruments

TMS320C28342ZFEQ

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TMS320C28342ZFEQ Overview

TMS320C2000? 32-bit microcontrollers are optimized for processing, sensing, and actuation to improve closed-loop performance in real-time control applications. The C2000? microcontrollers line includes the Delfino? Premium Performance microcontroller family and the Piccolo? Entry Performance microcontroller family.

The TMS320C2834x (C2834x) Delfino? microcontroller unit (MCU) devices build on TI’s existing F2833x high-performance floating-point microcontrollers. The C2834x delivers up to 300 MHz of floating-point performance, and has up to 516KB of on-chip RAM. Designed for real-time control applications, the C2834x is based on the C28x core, making it code-compatible with all C28x microcontrollers. The on-chip peripherals and low-latency core make the C2834x an excellent solution for performance-hungry real-time control applications.

The TMS320C28346, TMS320C28345, TMS320C28344, TMS320C28343, TMS320C28342, and TMS320C28341 devices, members of the Delfino? MCU generation, are highly integrated, high-performance solutions for demanding control applications.

Throughout this document, the devices are abbreviated as C28346, C28345, C28344, C28343, C28342, and C28341, respectively. Device Comparison provides a summary of features for each device.

ECAD Model

Symbol

TMS320C28342ZFEQ

Footprint

TMS320C28342ZFEQ

Features

  • High-Performance Static CMOS Technology
    • Up to 300 MHz (3.33-ns Cycle Time)
    • 1.1-V/1.2-V Core, 3.3-V I/O, 1.8-V PLL/Oscillator Design
  • High-Performance 32-Bit CPU (TMS320C28x)
    • IEEE 754 Single-Precision Floating-Point Unit (FPU)
    • 16 × 16 and 32 × 32 MAC Operations
    • 16 × 16 Dual MAC
    • Harvard Bus Architecture
    • Fast Interrupt Response and Processing
    • Code-Efficient (in C/C++ and Assembly)
  • Six-Channel DMA Controller (for McBSP, XINTF, and SARAM)
  • 16-Bit or 32-Bit External Interface (XINTF)
    • More Than 2M × 16 Address Reach
  • On-Chip Memory
    • Up to 258K × 16 SARAM
    • 8K × 16 Boot ROM
  • Clock and System Control
    • On-Chip Oscillator
    • Watchdog Timer Module
  • Peripheral Interrupt Expansion (PIE) Block That Supports All 64 Peripheral Interrupts
  • Endianness: Little Endian
  • Enhanced Control Peripherals
    • Eighteen Enhanced Pulse Width Modulator (ePWM) Outputs
      • Dedicated 16-Bit Time-Based Counter With Period and Frequency Control
      • Single-Edge, Dual-Edge Symmetric, or Dual-Edge Asymmetric Outputs
      • Dead-Band Generation
      • PWM Chopping by High-Frequency Carrier
      • Trip Zone Input
      • Up to 9 HRPWM Outputs With 55-ps MEP Resolution at VDD = 1.1 V (65 ps at 1.2 V)
    • Six 32-Bit Enhanced Capture (eCAP) Modules
      • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator Outputs
      • Single-Shot Capture of up to Four Event Timestamps
    • Three 32-Bit Quadrature Encoder Pulse (QEP) Modules
    • Six 32-Bit Timers and Nine 16-Bit Timers
  • Three 32-Bit CPU Timers
  • Serial Port Peripherals
    • Up to 2 CAN Modules
    • Up to 3 SCI (UART) Modules
    • Up to 2 McBSP Modules (Configurable as SPI)
    • Up to 2 SPI Modules
    • One Inter-Integrated Circuit (I2C) Bus
  • External ADC Interface
  • Up to 88 Individually Programmable, Multiplexed GPIO Pins With Input Filtering
  • Advanced Emulation Features
    • Analysis and Breakpoint Functions
    • Real-Time Debug Using Hardware
  • Package Options:
    • 256-Ball Plastic Ball Grid Array (BGA) (ZFE)
    • 179-Ball MicroStar BGA (ZHH)
  • Temperature Options:
    • T: –40°C to 105°C (ZFE, ZHH)
    • S: –40°C to 125°C (ZFE)
    • Q: –40°C to 125°C (ZFE)
      (AEC Q100 Qualification for Automotive Applications)

Applications

Automotive, AEC-Q100, TMS320C2834x Delfino?

Specifications

  • Clock Rate 300MHz

  • Operating Temperature -40℃ ~ 125℃ (TJ)

  • Type Floating Point

  • Non-Volatile Memory ROM (16 kB)

  • Package / Case 256-BGA

  • Voltage - Core 1.20V

  • Voltage - I/O 3.30V

  • Mounting Type Surface Mount

  • Interface CAN, EBI/EMI, I2C, McBSP, SCI, SPI

  • Supplier Device Package 256-BGA (17x17)

  • On-Chip RAM 196kB

Circuit Diagram

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