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ST STM32MP157CAC3

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STM32MP157CAC3 Overview

The STM32MP157C/F devices are based on the high-performance dual-core Arm® Cortex®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9.

The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-A17 processors, including virtualization support in hardware, NEON?, and 128-bit AMBA®4 AXI bus interface.
The STM32MP157C/F devices also embed a Cortex® -M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm® single-precision data-processing instructions and data types. The Cortex® -M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
The STM32MP157C/F devices also embed a 3D graphic processing unit (Vivante® - OpenGL® ES 2.0) running at up to 533 MHz, with performances up to 26 Mtriangle/s, 133 Mpixel/s.
The STM32MP157C/F devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.
The STM32MP157C/F devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.
All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell. The devices support six digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

Features

  • 32-bit dual-core Arm Cortex-A7
    • L1 32-Kbyte I / 32-Kbyte D for each core
    • 256-Kbyte unified level 2 cache
    • Arm NEON and Arm TrustZone
  • 32-bit Arm Cortex-M4 with FPU/MPU
    • Up to 209 MHz (Up to 703 CoreMark)
  • Memories
    • External DDR memory up to 1 Gbyte
      • up to LPDDR2/LPDDR3-1066 16/32-bit
      • up to DDR3/DDR3L-1066 16/32-bit
    • 708 Kbytes of internal SRAM: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain and 4 Kbytes of SRAM in Backup domain
    • Dual mode Quad-SPI memory interface
    • Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
  • Security/safety
    • Secure boot, TrustZone peripherals, active tamper
    • Cortex-M4 resources isolation
  • Reset and power management
    • 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
    • POR, PDR, PVD and BOR
    • On-chip LDOs (RETRAM, BKPSRAM, DSI 1.2 V, USB 1.8 V, 1.1 V)
    • Backup regulator (~0.9 V)
    • Internal temperature sensors
    • Low-power modes: Sleep, Stop and Standby
    • DDR memory retention in Standby mode
    • Controls for PMIC companion chip
  • Low-power consumption
    • Total current consumption down to 2 μA (Standby mode, no RTC, no LSE, no BKPSRAM, no RETRAM)
  • Clock management
    • Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
    • External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
    • 6 × PLLs with fractional mode
  • General-purpose input/outputs
    • Up to 176 I/O ports with interrupt capability
      • Up to 8 secure I/Os
      • Up to 6 Wakeup, 3 tampers, 1 active tamper
  • Interconnect matrix
    • 2 bus matrices
      • 64-bit Arm AMBA AXI interconnect, up to 266 MHz
      • 32-bit Arm AMBA AHB interconnect, up to 209 MHz
  • 3 DMA controllers to unload the CPU
    • 48 physical channels in total
    • 1 × high-speed general-purpose master direct memory access controller (MDMA)
    • 2 × dual-port DMAs with FIFO and request router capabilities for optimal peripheral management
  • Applications

    STM32MP1

    Product Parameter

    • Core Processor ARM Cortex A7

    • Display & Interface Controllers HDMI, LCD

    • Speed 209MHz, 650MHz

    • Operating Temperature -40℃ ~ 125℃ (TA)

    • Security Features ARM TZ

    • USB USB 2.0 (2), USB 2.0 OTG+ PHY (3)

    • Supplier Device Package 361-TFBGA (12x12)

    • Package / Case 361-TFBGA

    • Number of Cores/Bus Width 2 Core, 32-Bit

    • Ethernet 10/100Mbps (1)

    • RAM Controllers LPDDR2, LPDDR3, DDR3, DDR3L

    • Voltage - I/O 2.5V, 3.3V

    • Graphics Acceleration Yes

    • Co-Processors/DSP ARM Cortex M4

    STM32MP157CAC3 Related Keywords

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    • STM32MP157CAC3 Datasheet
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    • STM32MP157CAC3 Circuit diagram
    • STM32MP157CAC3 PDF
    • STM32MP157CAC3 Specifications
    • STM32MP157CAC3 Pin voltage

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