HIGH-PERFORMANCE AND DSP WITH DP
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STM32H747xI/G devices are based on the high-performance Arm® Cortex®-M7 and Cortex®-M4 32-bit RISC cores. The Cortex®-M7 core operates at up to 480 MHz and the Cortex®-M4 core at up to 240 MHz. Both cores feature a floating point unit (FPU) which supports Arm® single- and double-precision (Cortex®-M7 core) operations and conversions (IEEE 754 compliant), including a full set of DSP instructions and a memory protection unit (MPU) to enhance application security.
STM32H747xI/G devices incorporate high-speed embedded memories with a dual-bank Flash memory of up to 2 Mbytes, up to 1 Mbyte of RAM (including 192 Kbytes of TCM RAM, up to 864 Kbytes of user SRAM and 4 Kbytes of backup SRAM), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, 2x32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memory access.
All the devices offer three ADCs, two DACs, two ultra-low power comparators, a low-power RTC, a high-resolution timer, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG). The devices support four digital filters for external sigma-delta modulators (DFSDM). They also feature standard and advanced communication interfaces.
Footprint
Core Processor ARM Cortex M4, Cortex M7
Speed 240MHz, 480MHz
Operating Temperature -40℃ ~ 85℃ (TA)
Program Memory Type FLASH
RAM Size 1M x 8
Number of I/O 168
Peripherals Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Mounting Type Surface Mount
Oscillator Type Internal
Supplier Device Package 240+25-TFBGA (14x14)
Package / Case 265-TFBGA
Core Size 32-Bit Dual-Core
Connectivity CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG
Program Memory Size 2MB (2M x 8)
Data Converters A/D 36x16b; D/A 2x12b
Voltage - Supply (Vcc/Vdd) 1.62V ~ 3.6V
Manufacturer: Silicon Labs
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