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STM32F413ZGT6

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STM32F413ZGT6 Overview

The STM32F413xG/H devices are based on the high-performance Arm® Cortex®-M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

The STM32F413xG/H devices belong to the STM32F4 access product lines (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing to save even more power consumption during data batching.
The STM32F413xG/H devices incorporate high-speed embedded memories (up to 1.5 Mbytes of Flash memory, 320 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix.
All devices offer a 12-bit ADC, two 12-bit DACs, a low-power RTC, twelve general-purpose 16-bit timers including two PWM timer for motor control, two general-purpose 32-bit timers and a low power timer.
They also feature standard and advanced communication interfaces.

ECAD Model

Symbol

STM32F413ZGT6

Footprint

STM32F413ZGT6

Features

  • 1.7 V to 3.6 V power supply
  • -40 °C to 85/105/125 °C temperature range
  • Core: Arm 32-bit Cortex-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
  • Memories
    • Up to 1.5 Mbytes of Flash memory
    • 320 Kbytes of SRAM
    • Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR Flash memory
    • Dual mode Quad-SPI interface
  • LCD parallel interface, 8080/6800 modes
  • Clock, reset and supply management
    • 1.7 to 3.6 V application supply and I/Os
    • POR, PDR, PVD and BOR
    • 4-to-26 MHz crystal oscillator
    • Internal 16 MHz factory-trimmed RC
    • 32 kHz oscillator for RTC with calibration
    • Internal 32 kHz RC with calibration
  • Power consumption
    • Run: 112 μA/MHz (peripheral off)
    • Stop (Flash in Stop mode, fast wakeup time): 42 μA Typ.; 80 μA max @25 °C
    • Stop (Flash in Deep power down mode, slow wakeup time): 15 μA Typ.; 46 μA max @25 °C
    • Standby without RTC: 1.1 μA Typ.; 14.7 μA max at @85 °C
    • VBAT supply for RTC: 1 μA @25 °C
  • 2x12-bit D/A converters
  • 1×12-bit, 2.4 MSPS ADC: up to 16 channels
  • 6x digital filters for sigma delta modulator, 12x PDM interfaces, with stereo microphone and sound source localization support
  • General-purpose DMA: 16-stream DMA
  • Applications

    STM32F4

    Specifications

    • Core Processor ARM Cortex M4

    • Speed 100MHz

    • Operating Temperature -40℃ ~ 85℃ (TA)

    • Program Memory Type FLASH

    • RAM Size 320K x 8

    • Number of I/O 114

    • Peripherals Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT

    • Mounting Type Surface Mount

    • Oscillator Type Internal

    • Supplier Device Package 144-LQFP (20x20)

    • Package / Case 144-LQFP

    • Core Size 32-Bit

    • Connectivity CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SDIO, QSPI, SAI, SPI, UART/USART, USB OTG

    • Program Memory Size 1MB (1M x 8)

    • Data Converters A/D 16x12b; D/A 2x12b

    • Voltage - Supply (Vcc/Vdd) 1.7V ~ 3.6V

    Circuit Diagram

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