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ST STM32F412ZGJ6

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STM32F412ZGJ6 Overview

STM32F412xE/G devices are based on the high-performance Arm® Cortex® -M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

STM32F412xE/G devices belong to the STM32 Dynamic Efficiency? product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing even more power consumption saving during data batching.
STM32F412xE/G devices incorporate high-speed embedded memories (up to 1 Mbyte of Flash memory, 256 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix.
All devices offer one 12-bit ADC, a low-power RTC, twelve general-purpose 16-bit timers, two PWM timers for motor control and two general-purpose 32-bit timers.
They also feature standard and advanced communication interfaces:
In addition, STM32F412xE/G devices embed advanced peripherals:
STM32F412xE/G devices are offered in 7 packages ranging from 48 to 144 pins. The set of available peripherals depends on the selected package.
The STM32F412xE/G operates in the -40 to +125 °C temperature range from a 1.7 (PDR OFF) to 3.6 V power supply. A comprehensive set of power-saving modes allows the design of low-power applications.
These features make the STM32F412xE/G microcontrollers suitable for a wide range of applications.

ECAD Model

Symbol

STM32F412ZGJ6

Footprint

STM32F412ZGJ6

Features

  • Up to 1 Mbyte of Flash memory
  • 256 Kbyte of SRAM
  • Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR Flash memory
  • Dual mode Quad-SPI interface
  • LCD parallel interface, 8080/6800 modes
  • Clock, reset and supply management
    • 1.7 V to 3.6 V application supply and I/Os
    • POR, PDR, PVD and BOR
    • 4-to-26 MHz crystal oscillator
    • Internal 16 MHz factory-trimmed RC
    • 32 kHz oscillator for RTC with calibration
    • Internal 32 kHz RC with calibration
  • Power consumption
    • Run: 112 μA/MHz (peripheral off)
    • Stop (Flash in Stop mode, fast wakeup time): 50 μA Typ @ 25 °C; 75 μA max @25 °C
    • Stop (Flash in Deep power down mode, slow wakeup time): down to 18 μA @ 25 °C; 40 μA max @25 °C
    • Standby: 2.4 μA @25 °C / 1.7 V without RTC; 12 μA @85 °C @1.7 V
    • VBAT supply for RTC: 1 μA @25 °C
  • 1×12-bit, 2.4 MSPS ADC: up to 16 channels
  • 2x digital filters for sigma delta modulator, 4x PDM interfaces, stereo microphone support
  • General-purpose DMA: 16-stream DMA
  • Applications

    STM32F4

    Product Parameter

    • Core Processor ARM Cortex M4

    • Speed 100MHz

    • Operating Temperature -40℃ ~ 85℃ (TA)

    • Program Memory Type FLASH

    • RAM Size 256K x 8

    • Number of I/O 114

    • Peripherals Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT

    • Mounting Type Surface Mount

    • Oscillator Type Internal

    • Supplier Device Package 144-UFBGA (10x10)

    • Package / Case 144-UFBGA

    • Core Size 32-Bit

    • Connectivity CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB, USB OTG

    • Program Memory Size 1MB (1M x 8)

    • Data Converters A/D 16x12b

    • Voltage - Supply (Vcc/Vdd) 1.7V ~ 3.6V

    Circuit Diagram

    STM32F412ZGJ6 Related Keywords

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    • STM32F412ZGJ6 Datasheet
    • STM32F412ZGJ6 Picture
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    • STM32F412ZGJ6 Circuit diagram
    • STM32F412ZGJ6 PDF
    • STM32F412ZGJ6 Specifications
    • STM32F412ZGJ6 Pin voltage

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