STM32F412VEH3TR STMicroelectronics 32bit MCU

STM32F412VEH3TR Overview

STM32F412xE/G devices are based on the high-performance Arm® Cortex® -M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

STM32F412xE/G devices belong to the STM32 Dynamic Efficiency? product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing even more power consumption saving during data batching.
STM32F412xE/G devices incorporate high-speed embedded memories (up to 1 Mbyte of Flash memory, 256 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix.
All devices offer one 12-bit ADC, a low-power RTC, twelve general-purpose 16-bit timers, two PWM timers for motor control and two general-purpose 32-bit timers.
They also feature standard and advanced communication interfaces:
In addition, STM32F412xE/G devices embed advanced peripherals:
STM32F412xE/G devices are offered in 7 packages ranging from 48 to 144 pins. The set of available peripherals depends on the selected package.
The STM32F412xE/G operates in the -40 to +125 °C temperature range from a 1.7 (PDR OFF) to 3.6 V power supply. A comprehensive set of power-saving modes allows the design of low-power applications.
These features make the STM32F412xE/G microcontrollers suitable for a wide range of applications.

ECAD Model

Symbol

Footprint

Features

Up to 1 Mbyte of Flash memory
256 Kbyte of SRAM
Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR Flash memory
Dual mode Quad-SPI interface

LCD parallel interface, 8080/6800 modes

Clock, reset and supply management

1.7 V to 3.6 V application supply and I/Os
POR, PDR, PVD and BOR
4-to-26 MHz crystal oscillator
Internal 16 MHz factory-trimmed RC
32 kHz oscillator for RTC with calibration
Internal 32 kHz RC with calibration

Power consumption

Run: 112 μA/MHz (peripheral off)
Stop (Flash in Stop mode, fast wakeup time): 50 μA Typ @ 25 °C; 75 μA max @25 °C
Stop (Flash in Deep power down mode, slow wakeup time): down to 18 μA @ 25 °C; 40 μA max @25 °C
Standby: 2.4 μA @25 °C / 1.7 V without RTC; 12 μA @85 °C @1.7 V
V_BAT supply for RTC: 1 μA @25 °C

1×12-bit, 2.4 MSPS ADC: up to 16 channels

2x digital filters for sigma delta modulator, 4x PDM interfaces, stereo microphone support

General-purpose DMA: 16-stream DMA

Applications

STM32F4

Specifications

Core Processor ARM Cortex M4
Speed 100MHz
Operating Temperature -40℃ ~ 85℃ (TA)
Program Memory Type FLASH
RAM Size 256K x 8
Number of I/O 81
Peripherals Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Mounting Type Surface Mount
Oscillator Type Internal
Supplier Device Package 100-UFBGA (7x7)
Package / Case 100-UFBGA
Core Size 32-Bit
Connectivity CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB, USB OTG
Program Memory Size 512KB (512K x 8)
Data Converters A/D 16x12b
Voltage - Supply (Vcc/Vdd) 1.7V ~ 3.6V