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STM32F303VCY6TR

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STM32F303VCY6TR Overview

The STM32F303xB/STM32F303xC family is based on the high-performance Arm® Cortex®-M4 32-bit RISC core with FPU operating at a frequency of up to 72 MHz, and embedding a floating point unit (FPU), a memory protection unit (MPU) and an embedded trace macrocell (ETM). The family incorporates high-speed embedded memories (up to 256 Kbytes of Flash memory, up to 40 Kbytes of SRAM) and an extensive range of enhanced I/Os and peripherals connected to two APB buses.

The devices offer up to four fast 12-bit ADCs (5 Msps), seven comparators, four operational amplifiers, up to two DAC channels, a low-power RTC, up to five general-purpose 16-bit timers, one general-purpose 32-bit timer, and two timers dedicated to motor control. They also feature standard and advanced communication interfaces: up to two I2Cs, up to three SPIs (two SPIs are with multiplexed full-duplex I2Ss), three USARTs, up to two UARTs, CAN and USB. To achieve audio class accuracy, the I2S peripherals can be clocked via an external PLL.
The STM32F303xB/STM32F303xC family operates in the -40 to +85 °C and -40 to +105 °C temperature ranges from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications.
The STM32F303xB/STM32F303xC family offers devices in four packages ranging from 48 pins to 100 pins.
The set of included peripherals changes with the device chosen.

ECAD Model

Symbol

STM32F303VCY6TR

Footprint

STM32F303VCY6TR

Features

  • VDD, VDDA voltage range: 2.0 V to 3.6 V
  • Memories
    • 128 to 256 Kbytes of Flash memory
    • Up to 40 Kbytes of SRAM, with HW parity check implemented on the first 16 Kbytes.
    • Routine booster: 8 Kbytes of SRAM on instruction and data bus, with HW parity check (CCM)
  • CRC calculation unit
  • Reset and supply management
    • Power-on/power-down reset (POR/PDR)
    • Programmable voltage detector (PVD)
    • Low-power modes: Sleep, Stop and Standby
    • VBAT supply for RTC and backup registers
  • Clock management
    • 4 to 32 MHz crystal oscillator
    • 32 kHz oscillator for RTC with calibration
    • Internal 8 MHz RC with x 16 PLL option
    • Internal 40 kHz oscillator
  • Up to 87 fast I/Os
    • All mappable on external interrupt vectors
    • Several 5 V-tolerant
  • Interconnect matrix
  • 12-channel DMA controller
  • Four ADCs 0.20 μS (up to 39 channels) with selectable resolution of 12/10/8/6 bits, 0 to 3.6 V conversion range, single ended/differential input, separate analog supply from 2 to 3.6 V
  • Applications

    STM32F3

    Specifications

    • Core Processor ARM Cortex M4

    • Speed 72MHz

    • Operating Temperature -40℃ ~ 85℃ (TA)

    • Program Memory Type FLASH

    • RAM Size 40K x 8

    • Number of I/O 77

    • Peripherals DMA, I2S, POR, PWM, WDT

    • Mounting Type Surface Mount

    • Oscillator Type Internal

    • Supplier Device Package 100-WLCSP (4.2x4.7)

    • Package / Case 100-UFBGA, WLCSP

    • Core Size 32-Bit

    • Connectivity CANbus, I2C, IrDA, LINbus, SPI, UART/USART, USB

    • Program Memory Size 256KB (256K x 8)

    • Data Converters A/D 32x12b; D/A 2x12b

    • Voltage - Supply (Vcc/Vdd) 2V ~ 3.6V

    Circuit Diagram

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