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STM32F302ZET6

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STM32F302ZET6 Overview

The STM32F302xD/E family is based on the high-performance ARM®Cortex®-M4 32-bit RISC core with FPU operating at a frequency of 72 MHz, and embedding a floating point unit (FPU), a memory protection unit (MPU) and an embedded trace macrocell (ETM). The family incorporates high-speed embedded memories (512-Kbyte Flash memory, 64-Kbyte SRAM), a flexible memory controller (FSMC) for static memories (SRAM, PSRAM, NOR and NAND), and an extensive range of enhanced I/Os and peripherals connected to an AHB and two APB buses.

The devices offer two fast 12-bit ADCs (5 Msps), four comparators, two operational amplifiers, one DAC channel, a low-power RTC, up to two general-purpose 16-bit timers, one general-purpose 32-bit timer, and one timer dedicated to motor control. They also feature standard and advanced communication interfaces: up to three I2Cs, up to four SPIs (two SPIs are with multiplexed full-duplex I2Ss), three USARTs, up to two UARTs, CAN and USB. To achieve audio class accuracy, the I2S peripherals can be clocked via an external PLL.
The STM32F302xD/E family operates in the -40 to +85°C and -40 to +105°C temperature ranges from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications.
The STM32F302xD/E family offers devices in different packages ranging from 64 to 144 pins.
Depending on the device chosen, different sets of peripherals are included.

ECAD Model

Symbol

STM32F302ZET6

Footprint

STM32F302ZET6

Features

  • VDD, VDDAvoltage range: 2.0 V to 3.6 V
  • Memories
    • Up to 512 Kbytes of Flash memory
    • 64 Kbytes of SRAM, with HW parity check implemented on the first 32 Kbytes.
    • Flexible memory controller (FSMC) for static memories, with four Chip Select
  • CRC calculation unit
  • Reset and supply management
    • Power-on/Power-down reset (POR/PDR)
    • Programmable voltage detector (PVD)
    • Low-power modes: Sleep, Stop and Standby
    • VBATsupply for RTC and backup registers
  • Clock management
    • 4 to 32 MHz crystal oscillator
    • 32 kHz oscillator for RTC with calibration
    • Internal 8 MHz RC with x 16 PLL option
    • Internal 40 kHz oscillator
  • Up to 115 fast I/Os
    • All mappable on external interrupt vectors
    • Several 5 V-tolerant
  • Interconnect matrix
  • 12-channel DMA controller
  • Two ADCs 0.20 μs (up to 18 channels) with selectable resolution of 12/10/8/6 bits, 0 to 3.6 V conversion range, separate analog supply from 2.0 to 3.6 V
  • Applications

    STM32F3

    Specifications

    • Core Processor ARM Cortex M4

    • Speed 72MHz

    • Operating Temperature -40℃ ~ 85℃ (TA)

    • Program Memory Type FLASH

    • RAM Size 64K x 8

    • Number of I/O 115

    • Peripherals DMA, I2S, POR, PWM, WDT

    • Mounting Type Surface Mount

    • Oscillator Type Internal

    • Supplier Device Package 144-LQFP (20x20)

    • Package / Case 144-LQFP

    • Core Size 32-Bit

    • Connectivity CANbus, I2C, IrDA, LINbus, SPI, UART/USART, USB

    • Program Memory Size 512KB (512K x 8)

    • Data Converters A/D 18x12b; D/A 1x12b

    • Voltage - Supply (Vcc/Vdd) 2V ~ 3.6V

    Circuit Diagram

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