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R5F5630BDDFB#V0

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R5F5630BDDFB#V0 Overview

With flash memory capacities from small to large and package pin counts from low to high, the RX630 Group can satisfy the demands of a variety of embedded devices. All the products of the RX630 Group are equipped with E2 data flash capable of 100,000 rewrites and enhanced peripheral functions with increased numbers of channels including timers, USB 2.0 function module, serial communication interface, I2C bus interface, CAN, 10-bit and 12-bit A/D converter, and 10-bit D/A converter. In particular, built-in features such as RTC with timestamp, temperature sensor, independent WDT, and POR/LVD enable the number of external parts to be reduced. We are also planning on releasing small packages such as LGA and BGA.

 

ECAD Model

Symbol

R5F5630BDDFB#V0

Footprint

R5F5630BDDFB#V0

Applications

RX600

Specifications

  • Core Processor RX

  • Speed 100MHz

  • Operating Temperature -40℃ ~ 85℃ (TA)

  • Program Memory Type FLASH

  • RAM Size 96K x 8

  • Number of I/O 117

  • Peripherals DMA, LVD, POR, PWM, WDT

  • Mounting Type Surface Mount

  • Oscillator Type Internal

  • Supplier Device Package 144-LQFP (20x20)

  • EEPROM Size 32K x 8

  • Package / Case 144-LQFP

  • Core Size 32-Bit

  • Connectivity CANbus, EBI/EMI, I2C, LINbus, SCI, SPI, USB

  • Program Memory Size 1MB (1M x 8)

  • Data Converters A/D 8x10b, 21x12b; D/A 2x10b

  • Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.6V

Circuit Diagram

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