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Home > Embedded ICs > Embedded - Microprocessor Unit (MPU) > MPC8250AZQIHBC
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MPC8250AZQIHBC

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MPC8250AZQIHBC Overview

The PowerQUICC® II™ integrated communications processor family delivers excellent integration of processing power for networking and communications peripherals, providing customers with an innovative, total system solution for building high-end communications systems. NXP® Semiconductors's PowerQUICC II processor family is the next generation of the leading PowerQUICC™ line of integrated communications processors, providing higher performance in all areas of device operation, including greater flexibility, extended capabilities, and higher integration.

Our leading PowerQUICC architecture integrates two processing blocks. One block is a high-performance embedded G2 core and the second block is the Communications Processor Module (CPM). The CPM of the MPC8255 processor can support up to two fast serial communications controllers (FCCs), one multichannel controller (MCC), four serial communications controllers (SCCs), two serial management controllers (SMCs), one serial peripheral interface (SPI) and one I2C interface. The combination of the G2 core and the CPM, along with the versatility and performance of the PowerQUICC II processor family, provides customers with enormous potential in developing networking and communications products while significantly reducing time-to-market development stages.

Features

  • 300 MHz high-speed embedded G2 core
  • Powerful memory controller and system functions
  • Enhanced 32-bit RISC communications processor module
  • Up to two multiport 10/100 Mbps ethernet MAC
  • Up to two UTOPIA II ATM interfaces
  • Up to 128 HDLC channels (each channel 64 Kbps, full duplex)
  • Up to four 10 Mbps ethernet MAC
  • Strong 3rd-party tools support from 恩智浦合作伙伴计划 partner program members

Typical Applications

  • Remote Access Concentrators
  • Regional Office Routers
  • Cellular Infrastructure equipment
  • Telecom Switching Equipment
  • Ethernet Switches
  • T1/E1-to-T3/E3 Bridges
  • xDSL Systems

Technical Specifications

  • Embedded G2 core at 300 MHz
    • 570 MIPS at 300 MHz (Dhrystone 2.1)
    • High-performance, superscalar microprocessor
    • Disable CPU mode
    • Supports the NXP® external L2 cache chip (MPC2605)
    • Improved low-power core
    • 16 Kbyte data and 16 Kbyte instruction cache
    • Memory Management Unit
    • Floating Point Unit
    • Common On-chip Processor (COP)
  • System Interface Unit (SIU)
    • Memory controller, including two dedicated SDRAM machines
    • PCI up to 66 MHz
    • Hardware bus monitor and software watchdog timer
    • IEEE 1149.1 JTAG test access port
  • High-Performance CPM with operating frequency of 133 MHz
    • Parallel I/0 registers
    • On-board 32 Kbytes of dual-port RAM
    • One multichannel controller (MCC), each supporting 128 full-duplex, 64 Kbps, HDLC lines
    • Virtual DMA functionality
    • Two FCCs supporting 10/100 Mbps Ethernet (up to two) (IEEE 802.3X with Flow Control)
    • Three MII interfaces
    • Four TDM interfaces (T1/E1) supporting four T1 lines or one T3 line
  • Two bus architectures: one 64-bit 60x bus and one 32-bit PCI or local bus
    • Integrated PCI interface
  • 1.8V or 2.0V internal and 3.3V I/O
  • 300 MHz power consumption: ~3 W
  • 480 TBGA package (37.5 x 37.5 mm)

Applications

MPC82xx

Specifications

  • Core Processor PowerPC G2

  • Speed 200MHz

  • Operating Temperature 0℃ ~ 105℃ (TA)

  • Package / Case 516-BBGA

  • Number of Cores/Bus Width 1 Core, 32-Bit

  • Ethernet 10/100Mbps (3)

  • RAM Controllers DRAM, SDRAM

  • Voltage - I/O 3.3V

  • Graphics Acceleration No

  • Supplier Device Package 516-FPBGA (27x27)

  • Co-Processors/DSP Communications; RISC CPM

Circuit Diagram

MPC8250

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