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Home > Embedded ICs > Automotive grade MCU > MM912H634DM1AER2
NXP

MM912H634DM1AER2

MM912H634DM1AER2

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MM912H634DM1AER2 Overview

The MM912G634 (48 kB) and MM912H634 (64 kB) are integrated single package solutions that integrate an HCS12 MCU with a SMARTMOS® analog control IC. The Die to Die Interface (D2D) controlled analog die combines system base chip and application-specific functions, including a LIN transceiver.

Your customer benefits include:

  • Integrated MCU and analog features in the same package solution
  • A full LIN solution
  • Easy control of high-current motors using relays and current sense features
  • Reduced space, resulting in enhanced reliability
  • Full protection for output stages
  • Economical multifunction solution with few components
  • Low-power mode flexibility
  • Reverse-battery-protected voltage sense

View internal diagram

Features

  • 16-Bit S12 CPU, 64/48/32 kByte Program Flash
  • 4/2/0 kByte Data Flash
  • 6/2/2 kBytes of RAM
  • Background debug (BDM) & debug module (DBG)
  • 16-Bit, 4 Channel - Timer Module (TIM16B4C)
  • Die to Die bus interface for transparent memory mapping
Standard I/O
  • 6 or 10 digital MCU GPIOs shared with SPI
  • 10-Bit, 15 Channel - Analog to Digital Converter (ADC)
  • 8-Bit, 2 Channel - Pulse width modulation module (PWM)
Application Specific Functions
  • On-chip oscillator & two independent watchdogs
  • LIN 2.1 Physical Layer Interface with integrated SCI
  • Six high voltage / Wake-up inputs (L5…0)
  • Three low voltage GPIOs (PB2…0)
  • Low power modes with cyclic sense & forced wake-up
  • Two protected low side outputs to drive inductive loads
  • Two protected high side outputs
  • Hall sensor supply & integrated voltage regulator(s)
  • Reverse battery protected voltage sense module
  • Chip temperature sensor
  • Current sense module with selectable gain
Product Longevity
  • The MM912F634 is included in NXP®.s product longevity program, with assured supply for a minimum of 15 years after launch

Applications

-

Specifications

  • Core Processor S12

  • Operating Temperature -40℃ ~ 105℃

  • Program Memory Type FLASH (64kB)

  • Applications Automotive

  • Package / Case 48-LQFP Exposed Pad

  • Voltage - Supply 2.25V ~ 5.5V

  • RAM Size 6K x 8

  • Number of I/O 9

  • Mounting Type Surface Mount

  • Controller Series HCS12

  • Interface LIN, SCI

  • Supplier Device Package 48-LQFP (7x7)

Circuit Diagram

MM912_634

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