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Home > Embedded ICs > 16bit MCU > MC9S12DT256MPVE

NXP MC9S12DT256MPVE

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ECAD Model

Footprint

MC9S12DT256MPVE

Applications

HCS12

Product Parameter

  • Core Processor HCS12

  • Speed 25MHz

  • Operating Temperature -40℃ ~ 125℃ (TA)

  • Program Memory Type FLASH

  • RAM Size 12K x 8

  • Number of I/O 91

  • Peripherals PWM, WDT

  • Mounting Type Surface Mount

  • Oscillator Type Internal

  • Supplier Device Package 112-LQFP (20x20)

  • EEPROM Size 4K x 8

  • Package / Case 112-LQFP

  • Core Size 16-Bit

  • Connectivity CANbus, I2C, SCI, SPI

  • Program Memory Size 256KB (256K x 8)

  • Data Converters A/D 8x10b

  • Voltage - Supply (Vcc/Vdd) 2.35V ~ 5.25V

Circuit Diagram

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