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Home > Embedded ICs > Embedded - Microcontroller Unit (MCU) > LPC55S66JBD100K
NXP

LPC55S66JBD100K

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ECAD Model

Symbol

LPC55S66JBD100K

Footprint

LPC55S66JBD100K

Applications

LPC55S6x

Specifications

  • Core Processor ARM Cortex M33

  • Speed 100MHz

  • Operating Temperature -40℃ ~ 105℃ (TA)

  • Program Memory Type FLASH

  • RAM Size 144K x 8

  • Number of I/O 64

  • Peripherals Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT

  • Mounting Type Surface Mount

  • Oscillator Type Internal

  • Supplier Device Package 100-HLQFP (14x14)

  • Package / Case 100-LQFP Exposed Pad

  • Core Size 32-Bit

  • Connectivity Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB

  • Program Memory Size 256KB (256K x 8)

  • Data Converters A/D 10x16b

  • Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V

Circuit Diagram

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