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LPC4367JET256E

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LPC4367JET256E Overview

The LPC436x are Arm Cortex-M4 based microcontrollers for embedded applications, whichinclude an Arm Cortex-M0 coprocessor and an ArmCortex-M0 subsystem for managingperipherals, up to 1 MB of flash and 154 kB of on-chip SRAM, 16 kB of EEPROM memory, aquad SPI Flash Interface (SPIFI), advanced configurable peripherals such as theSCTimer/PWM and the Serial General Purpose I/O (SGPIO) interface, two High-speed USBcontrollers, Ethernet, LCD, an external memory controller, and multiple digital andanalog peripherals. The LPC436x operate at CPU frequencies of up to 204 MHz.

The Arm Cortex-M4 is a 32-bit core that offers system enhancements such as low powerconsumption, enhanced debug features, and a high level of support block integration. TheArm Cortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture withseparate local instruction and data buses as well as a third bus for peripherals, andincludes an internal prefetch unit that supports speculative branching. The ArmCortex-M4 supports single-cycle digital signal processing and SIMD instructions. Ahardware floating-point processor is integrated into the core.

The LPC436x include an application Arm Cortex-M0 coprocessor and a second Arm Cortex-M0subsystem for managing the SGPIO and SPI peripherals.The Arm Cortex-M0 coprocessor is anenergy-efficient and easy-to-use 32-bit core which is upward code- and tool-compatiblewith the Cortex-M4 core. The Cortex-M0 coprocessor, designed as a replacement forexisting 8/16-bit microcontrollers, offers up to 204 MHz performance with a simpleinstruction set and reduced code size. In LPC436x, the Cortex-M0 coprocessor hardwaremultiply is implemented as a 32-cycle iterative multiplier.

Features

  • Arm Cortex-M4 processor (version r0p1), running at frequencies of upto 204 MHz.
  • Built-in Memory Protection Unit (MPU) supporting eight regions.
  • Built-in Nested Vectored Interrupt Controller (NVIC).
  • Hardware floating-point unit.
  • Non-maskable Interrupt (NMI) input.
  • JTAG and Serial Wire Debug (SWD), serial trace, eight breakpoints,and four watch points.
  • Enhanced Trace Module (ETM) and Enhanced Trace Buffer (ETB)support.
  • System tick timer.
  • Cortex-M0 Processor core
    • Arm Cortex-M0 co-processor (version r0p0) capable of off-loading themain Arm Cortex-M4 application processor.
    • Running at frequencies of up to 204 MHz.
    • JTAG
    • Built-in NVIC.
  • Cortex-M0 subsystem
    • Arm Cortex-M0 coprocessor controlling the SPI and SGPIO residing on aseparate AHB multilayer matrix. Includes 2 kB + 16 kB of SRAM.
    • Running at frequencies of up to 204 MHz.
    • Connected via a core-to-core bridge to the main AHB multilayer matrixand the main Arm Cortex-M4 processor.
    • JTAG and built-in NVIC.
  • On-chip memory
    • Up to 1 MB on-chip dual bank flash memory with flash accelerator.
    • 16 kB on-chip EEPROM data memory.
    • 154 kB SRAM for code and data use.
    • Multiple SRAM blocks with separate bus access. Two SRAM blocks can bepowered down individually.
    • 64 kB ROM containing boot code and on-chip software drivers.
    • 64 bit+ 256 bit of One-Time Programmable (OTP) memory forgeneral-purpose use.
  • Configurable digital peripherals
    • Serial GPIO (SGPIO) interface.
    • SCTimer/PWM subsystem on AHB.
    • Global Input Multiplexer Array (GIMA) allows to cross-connectmultiple inputs and outputs to event driven peripherals like thetimers, SCTimer/PWM, and ADC0/1.
  • Serial interfaces
    • Quad SPI Flash Interface (SPIFI) with four lanes and up to 52 MB persecond.
    • 10/100T Ethernet MAC with RMII and MII interfaces and DMA support forhigh throughput at low CPU load. Support for IEEE 1588 timestamping/advanced time stamping (IEEE 1588-2008 v2).
    • One High-speed USB 2.0 Host/Device/OTG interface with DMA support andon-chip high-speed PHY.
    • One High-speed USB 2.0 Host/Device interface with DMA support,on-chip full-speed PHY and ULPI interface to external high-speedPHY.
    • USB interface electrical test software included in ROM USB stack.
    • One 550 UART with DMA support and full modem interface.
    • Three 550 USARTs with DMA and synchronous mode support and a smartcard interface conforming to ISO7816 specification. One USART withIrDA interface.
    • Up to two C_CAN 2.0B controllers with one channel each.
    • Two SSP controllers with FIFO and multi-protocol support. Both SSPswith DMA support.
    • One SPI controller.
    • One Fast-mode Plus I²C-bus interface with monitor mode andwith open-drain I/O pins conforming to the full I²C-busspecification. Supports data rates of up to 1 Mbit/s.
    • One standard I²C-bus interface with monitor mode and withstandard I/O pins.
    • Two I²S interfaces, each with DMA support and with oneinput and one output.
  • Digital peripherals
    • External Memory Controller (EMC) supporting external SRAM, ROM, NORflash, and SDRAM devices.
    • LCD controller with DMA support and a programmable display resolutionof up to 1024 H × 768 V. Supports monochrome and color STN panelsand TFT color panels; supports 1/2/4/8 bpp Color Look-Up Table(CLUT) and 16/24-bit direct pixel mapping. Available on partsLPC4357/53 only.
    • Secure Digital Input Output (SD/MMC) card interface.
    • Eight-channel General-Purpose DMA controller can access all memorieson the AHB and all DMA-capable AHB slaves.
    • Up to 164 General-Purpose Input/Output (GPIO) pins with configurablepull-up/pull-down resistors.
    • GPIO registers are located on the AHB for fast access. GPIO portshave DMA support.
    • Up to eight GPIO pins can be selected from all GPIO pins as edge andlevel sensitive interrupt sources.
    • Two GPIO group interrupt modules enable an interrupt based on aprogrammable pattern of input states of a group of GPIO pins.
    • Four general-purpose timer/counters with capture and matchcapabilities.
    • One motor control Pulse Width Modulator (PWM) for three-phase motorcontrol.
    • One Quadrature Encoder Interface (QEI).
    • Repetitive Interrupt timer (RI timer).
    • Windowed watchdog timer (WWDT).
    • Ultra-low power Real-Time Clock (RTC) on separate power domain with256 bytes of battery powered backup registers.
    • Alarm timer; can be battery powered.
  • Analog peripherals
    • One 10-bit DAC with DMA support and a data conversion rate of 400kSamples/s.
    • Two 10-bit ADCs with DMA support and a data conversion rate of 400kSamples/s. Up to eight input channels per ADC.
  • Unique ID for each device.
  • Clock generation unit
    • Crystal oscillator with an operating range of 1 MHz to 25 MHz.
    • 12 MHz internal RC oscillator trimmed to 3 % accuracy overtemperature and voltage (1.5 % accuracy for Tamb = 0 °Cto 85 °C).
    • Ultra-low power Real-Time Clock (RTC) crystal oscillator.
    • Three PLLs allow CPU operation up to the maximum CPU rate without theneed for a high-frequency crystal. The second PLL can be used withthe High-speed USB, the third PLL can be used as audio PLL.
    • Clock output.
  • Power
    • Single 3.3 V (2.4 V to 3.6 V) power supply with on-chip DC-to-DCconverter for the core supply and the RTC power domain.
    • RTC power domain can be powered separately by a 3 V batterysupply.
    • Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deeppower-down.
    • Processor wake-up from Sleep mode via wake-up interrupts from variousperipherals.
    • Wake-up from Deep-sleep, Power-down, and Deep power-down modes viaexternal interrupts and interrupts generated by battery poweredblocks in the RTC power domain.
    • Brownout detect with four separate thresholds for interrupt andforced reset.
    • Power-On Reset (POR).
  • Available as LQFP208, LBGA256, or TFBGA100 packages.
  • Target Applications
    • Industrial HMI
    • Secure IoT Gateways
    • Industrial automation
    • Industrial control
    • Consumer health devices
    • Communication hubs
    • Embedded audio applications
    • Automotive aftermarket
    • White goods

    Applications

    LPC43xx

    Specifications

    • Core Processor ARM Cortex M4/M0

    • Speed 204MHz

    • Operating Temperature -40℃ ~ 105℃ (TA)

    • Program Memory Type FLASH

    • RAM Size 154K x 8

    • Number of I/O 164

    • Peripherals Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT

    • Mounting Type Surface Mount

    • Oscillator Type Internal

    • Supplier Device Package 256-LBGA (17x17)

    • EEPROM Size 16K x 8

    • Package / Case 256-LBGA

    • Core Size 32-Bit Dual-Core

    • Connectivity CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG

    • Program Memory Size 1MB (1M x 8)

    • Data Converters A/D 16x10b; D/A 1x10b

    • Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V

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