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NXP LPC4322JET100E

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LPC4322JET100E Overview

The LPC435x/3x/2x/1x are Arm Cortex-M4 based microcontrollers for embeddedapplications which include an Arm Cortex-M0 coprocessor, up to 1 MB of flash and136 kB of on-chip SRAM, 16 kB of EEPROM memory, a quad SPI Flash Interface (SPIFI),advanced configurable peripherals such as the State Configurable Timer (SCT) and theSerial General Purpose I/O (SGPIO) interface, two High-speed USB controllers, Ethernet,LCD, an external memory controller, and multiple digital and analog peripherals. TheLPC435x/3x/2x/1x operate at CPU frequencies of up to 204 MHz.

The Arm Cortex-M4 is a next generation 32-bit core that offers system enhancementssuch as low power consumption, enhanced debug features, and a high level of supportblock integration. The Arm Cortex-M4 CPU incorporates a 3-stage pipeline, uses aHarvard architecture with separate local instruction and data buses as well as a third busfor peripherals, and includes an internal prefetch unit that supports speculative branching.The Arm Cortex-M4 supports single-cycle digital signal processing and SIMDinstructions. A hardware floating-point unit is integrated in the core.

The Arm Cortex-M0 coprocessor is an energy-efficient and easy-to-use 32-bit core whichis upward code- and tool-compatible with the Cortex-M4 core. The Cortex-M0coprocessor, designed as a replacement for existing 8/16-bit microcontrollers, offers up to204 MHz performance with a simple instruction set and reduced code size.

ECAD Model

Symbol

LPC4322JET100E

Footprint

LPC4322JET100E

Features

  • Cortex-M4 Processor core
    • Arm Cortex-M4 processor, running at frequencies of up to 204 MHz
    • Arm Cortex-M4 built-in Memory Protection Unit (MPU) supporting eight regions
    • Arm Cortex-M4 built-in Nested Vectored Interrupt Controller (NVIC)
    • Hardware floating-point unit
    • Non-maskable Interrupt (NMI) input
    • JTAG and Serial Wire Debug (SWD), serial trace, eight breakpoints, and four watchpoints
    • Enhanced Trace Module (ETM) and Enhanced Trace Buffer (ETB) support
    • System tick timer
  • Cortex-M0 Processor core
    • Arm Cortex-M0 co-processor capable of off-loading the main ArmCortex-M4application processor
    • Running at frequencies of up to 204 MHz
    • JTAG
    • Built-in NVIC
  • On-chip memory
    • Up to 1 MB on-chip dual bank flash memory with flash accelerator
    • 16 kB on-chip EEPROM data memory
    • 136 kB SRAM for code and data use
    • Multiple SRAM blocks with separate bus access. Two SRAM blocks can bepowered down individually
    • 64 kB ROM containing boot code and on-chip software drivers
    • 64 bit of general-purpose One-Time Programmable (OTP) memory
  • Configurable digital peripherals
    • Serial GPIO (SGPIO) interface
    • State Configurable Timer (SCT) subsystem on AHB
    • Global Input Multiplexer Array (GIMA) allows to cross-connect multiple inputs andoutputs to event driven peripherals like the timers, SCT, and ADC0/1
  • Serial interfaces
    • Quad SPI Flash Interface (SPIFI) with four lanes and up to 52 MB per second
    • One High-speed USB 2.0 Host/Device/OTG interface with DMA support andon-chip high-speed PHY
    • One High-speed USB 2.0 Host/Device interface with DMA support, on-chipfull-speed PHY and ULPI interface to external high-speed PHY
    • USB interface electrical test software included in ROM USB stack
    • One 550 UART with DMA support and full modem interface
    • Three 550 USARTs with DMA and synchronous mode support and a smart cardinterface conforming to ISO7816 specification. One USART with IrDA interface
    • Up to two C_CAN 2.0B controllers with one channel each. Use of C_CAN controllerexcludes operation of all other peripherals connected to the same bus bridge
    • Two SSP controllers with FIFO and multi-protocol support. Both SSPs with DMAsupport
    • One SPI controller
    • One Fast-mode Plus I²C-bus interface with monitor mode and with open-drain I/Opins conforming to the full I²C-bus specification. Supports data rates of up to1 Mbit/s
    • One standard I²C-bus interface with monitor mode and with standard I/O pins
    • Two I²S interfaces, each with DMA support and with one input and one output
  • Digital peripherals
    • External Memory Controller (EMC) supporting external SRAM, ROM, NOR flash,and SDRAM devices
    • LCD controller with DMA support and a programmable display resolution of up to1024 H x 768 V. Supports monochrome and color STN panels and TFT colorpanels; supports 1/2/4/8 bpp Color Look-Up Table (CLUT) and 16/24-bit direct pixelmapping. Available on parts LPC4357/53 only
    • Secure Digital Input Output (SD/MMC) card interface
    • Eight-channel General-Purpose DMA controller can access all memories on theAHB and all DMA-capable AHB slaves
    • Up to 164 General-Purpose Input/Output (GPIO) pins with configurablepull-up/pull-down resistors
    • GPIO registers are located on the AHB for fast access. GPIO ports have DMAsupport
    • Up to eight GPIO pins can be selected from all GPIO pins as edge and levelsensitive interrupt sources
    • Two GPIO group interrupt modules enable an interrupt based on a programmablepattern of input states of a group of GPIO pins
    • Four general-purpose timer/counters with capture and match capabilities
    • One motor control Pulse Width Modulator (PWM) for three-phase motor control
    • One Quadrature Encoder Interface (QEI)
    • Repetitive Interrupt timer (RI timer)
    • Windowed watchdog timer (WWDT)
    • Ultra-low power Real-Time Clock (RTC) on separate power domain with 256 bytesof battery powered backup registers
    • Alarm timer; can be battery powered
  • Analog peripherals
    • One 10-bit DAC with DMA support and a data conversion rate of 400 kSamples/s
    • Two 10-bit ADCs with DMA support and a data conversion rate of 400 kSamples/s.Up to eight input channels per ADC
  • Unique ID for each device
  • Clock generation unit
    • Crystal oscillator with an operating range of 1 MHz to 25 MHz
    • 12 MHz internal RC oscillator trimmed to 2 % accuracy over temperature andvoltage (1 % accuracy for Tamb = 0 °C to 85 °C)
    • Ultra-low power Real-Time Clock (RTC) crystal oscillator
    • Three PLLs allow CPU operation up to the maximum CPU rate without the need fora high-frequency crystal. The second PLL can be used with the High-speed USB,the third PLL can be used as audio PLL
    • Clock output
  • Power
    • Single 3.3 V (2.2 V to 3.6 V) power supply with on-chip DC-to-DC converter for thecore supply and the RTC power domain
    • RTC power domain can be powered separately by a 3 V battery supply
    • Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deeppower-down
    • Processor wake-up from Sleep mode via wake-up interrupts from variousperipherals
    • Wake-up from Deep-sleep, Power-down, and Deep power-down modes viaexternal interrupts and interrupts generated by battery powered blocks in the RTCpower domain
    • Brownout detect with four separate thresholds for interrupt and forced reset
    • Power-On Reset (POR)
  • Available as LQFP208, LQFP144, LBGA256, or TFBGA100 packages
Target Applications
  • Motor control
  • Power management
  • White goods
  • RFID readers
  • Embedded audio applications
  • Industrial automation
  • e-metering

Applications

LPC43xx

Product Parameter

  • Core Processor ARM Cortex M4/M0

  • Speed 204MHz

  • Operating Temperature -40℃ ~ 105℃ (TA)

  • Program Memory Type FLASH

  • RAM Size 104K x 8

  • Number of I/O 49

  • Peripherals Brown-out Detect/Reset, DMA, I2S, POR, WDT

  • Mounting Type Surface Mount

  • Oscillator Type Internal

  • Supplier Device Package 100-TFBGA (9x9)

  • EEPROM Size 16K x 8

  • Package / Case 100-TFBGA

  • Core Size 32-Bit Dual-Core

  • Connectivity CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG

  • Program Memory Size 512KB (512K x 8)

  • Data Converters A/D 4x10b; D/A 1x10b

  • Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V

Circuit Diagram

LPC4322JET100E Related Keywords

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