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LPC2929FBD144-S

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LPC2929FBD144-S Overview

The LPC2926/2927/2929 combine an ARM968E-S CPU core with two integrated TCM blocks operating at frequencies of up to 125 MHz, Full-speed USB 2.0 OTG and device controller, CAN and LIN, 56 kB SRAM, up to 768 kB flash memory, external memory interface, three 10-bit ADCs, and multiple serial and parallel interfaces in a single chip targeted at consumer, industrial and communication markets. To optimize system power consumption, the LPC2926/2927/2929 has a very flexible Clock Generation Unit (CGU) that provides dynamic clock gating and scaling.

Features

  • ARM968E-S processor running at frequencies of up to 125 MHz maximum.
  • Multi-layer AHB system bus at 125 MHz with three separate layers.
  • Dual-master, eight-channel GPDMA controller on the AHB multilayer matrix whICh can be used with the Serial Peripheral Interface (SPI) interfaces and the UARTs, as well as for memory-to-memory transfers including the TCM memories.
  • External Static Memory Controller (SMC) with eight memory banks; up to 32-bit data bus; up to 24-bit address bus.
  • Up to 104 general-purpose I/O pins with programmable pull-up, pull-down, or bus keeper.
  • Vectored Interrupt Controller (VIC) with 16 priority levels.
  • Up to 16 level-sensitive external interrupt pins, including USB, CAN and LIN wake-up features.
  • Configurable clock-out pin for driving external system clocks.
  • Processor wake-up from power-down via external interrupt pins; CAN or LIN activity.
  • Flexible Reset Generator Unit (RGU) able to control resets of individual modules.
  • Second CGU (CGU1) with its own PLL generates a configurable clock output.
  • Standard Arm® test and debug interface with real-time in-circuit emulator.
  • Boundary-scan test supported.
  • ETM/ETB debug functions with 8 kB of dedicated SRAM also accessible for application code and data storage.
  • 144-pin LQFP package.
  • -40 °C to +85 °C ambient operating temperature range.
On-chip memory
  • Two Tightly Coupled Memories (TCM), 32 kB Instruction TCM (ITCM), 32 kB Data TCM (DTCM).
  • Two separate internal Static RAM (SRAM) instances; 32 kB SRAM and 16 kB SRAM.
  • 8 kB ETB SRAM also available for code execution and data.
  • Up to 768 kB high-speed flash-program memory.
  • 16 kB true EEPROM, byte-erasable and programmable.
Serial interfaces
  • USB 2.0 full-speed device/OTG controller with dedicated DMA controller and on-chip device PHY.
  • Two-channel CAN controller supporting FullCAN and extensive message filtering
  • Two LIN master controllers with full hardware support for LIN communication. The LIN interface can be configured as UART to provide two additional UART interfaces.
  • Two 550 UARTs with 16-byte Tx and Rx FIFO depths, DMA support, and RS485/EIA-485 (9 bit) support.
  • Three full-duplex Q-SPIs with four slave-select lines; 16 bits wide; 8 locations deep; Tx FIFO and Rx FIFO.
  • Two I²C-bus interfaces.
Flexible Clock-Generation Unit (CGU0) able to control clock frequency of individual modules
  • On-chip very low-power ring oscillator; fixed frequency of 0.4 MHz; always on to provide a Safe_Clock source for system monitoring.
  • On-chip crystal oscillator with a recommended operating range from 10 MHz to 25 MHz. PLL input range 10 MHz to 25 MHz.
  • On-chip PLL allows CPU operation up to a maximum CPU rate of 125 MHz.
  • Generation of up to 11 base clocks.
  • Seven fractional dividers.
Highly configurable system Power Management Unit (PMU)
  • clock control of individual modules.
  • allows minimization of system operating power consumption in any configuration.
Dual power supply
  • CPU operating voltage: 1.8 V ± 5 %.
  • I/O operating voltage: 2.7 V to 3.6 V; inputs tolerant up to 5.5 V.
Other peripherals
  • One 10-bit ADC with 5.0 V measurement range and eight input channels with conversion times as low as 2.44 μs per channel.
  • Two 10-bit ADCs, 8-channels each, with 3.3 V measurement range provide an additional 16 analog inputs with conversion times as low as 2.44 μs per channel. Each channel provides a compare function to minimize interrupts.
  • Multiple trigger-start option for all ADCs: timer, PWM, other ADC, and external signal input.
  • Four 32-bit timers each containing four capture-and-compare registers linked to I/Os.
  • Four six-channel PWMs (Pulse-Width Modulators) with capture and trap functionality.
  • Two dedicated 32-bit timers to schedule and synchronize PWM and ADC.
  • Quadrature encoder interface that can monitor one external quadrature encoder.
  • 32-bit watchdog with timer change protection, running on safe clock.

Specifications

  • Mounting Style SMD/SMT

  • Part # Aliases LPC2929FBD144,551

  • Program Memory Type Flash

  • Data Bus Width 32 bit

  • Number of Timers 4 x 32 bit

  • Minimum Operating Temperature - 40 C

  • Series LPC2900

  • Package / Case LQFP-144

  • Operating Supply Voltage 1.8 V, 2.7 V to 3.6 V

  • Length 20 mm

  • Maximum Clock Frequency 125 MHz

  • Packaging Tray

  • Program Memory Size 768 KB

  • Maximum Operating Temperature + 85 C

  • Number of Programmable I/Os 104

  • On-Chip ADC Yes

  • Data RAM Size 56 KB

  • Interface Type CAN, LIN, USB OTG

  • A/D Bit Size 10 bit

  • A/D Channels Available 8

  • Core ARM968E-S

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