DS90UB935TRHBRQ1 Texas Instruments MCU

DS90UB935TRHBRQ1 Overview

The DS90UB935TRHBRQ1 serializer is part of TI's FPDLink III device family designed to support highspeed raw data sensors including cameras, satellite RADAR, LIDAR, and Time-of-Flight (ToF) sensors. The chip delivers a high-speed forward channel and an ultra-low latency, bidirectional control channel and supports power over a single coax (PoC) or STP cable. The DS90UB935TRHBRQ1 features advanced data protection and diagnostic features to support ADAS and autonomous driving. Together with a companion deserializer, the DS90UB935TRHBRQ1 delivers precise multi-camera sensor clock and sensor synchronization.

The DS90UB935TRHBRQ1 is fully AEC-Q100 qualified with a -40°C to 105°C wide temperature range. AECQ100 qualification includes HBM ESD Classification Level 3A and CDM ESD Classification Level C6. The serializer comes in a small 5-mm × 5-mm VQFN package for space-constrained sensor applications.

Features

• AEC-Q100 qualified for automotive applications: – Device temperature : –40°C to +105°C ambient operating temperature

• ISO 10605 and IEC 61000-4-2 ESD compliant

• Power-over-Coax (PoC) compatible transceiver

• D-PHY v1.2 and CSI-2 v1.3 compliant system interface – Up to 2.528-Gbps CSI-2 Bandwidth – Supports up to four virtual channels

• Precision multi-camera clocking and synchronization

• Flexible programmable output clock generator

• Advanced data protection and diagnostics including CRC data protection, sensor data integrity check, I2C write protection, voltage and temperature measurement, programmable alarm, and line fault detection

• Supports Single-ended coaxial or shielded-twistedpair (STP) cable

• Ultra-low latency bidirectional I2C and GPIO control channel enables ISP control from ECU

• Single 1.8-V power supply

• Low (0.28 W typical) power consumption

• Compatible With DS90UB936-Q1, DS90UB954- Q1, DS90UB960-Q1, DS90UB934-Q1, DS90UB914A-Q1 Deserializers

• Wide temperature range: –40°C to 105°C

• Small 5-mm × 5-mm VQFN package and PoC solution size for compact camera module designs