CC2564CRVMR TI Ethernet

CC2564CRVMR Overview

The TI CC2564C device is acomplete Bluetooth? BR, EDR, and lowenergy HCI solution that reduces design effort andenables fast time to market. Based on TI’sseventh-generation Bluetooth core, the CC2564Cdevice provides a product-proven solution thatis Bluetooth 4.2 compliant.

When coupled with amicrocontrollerunit (MCU), this HCI device offers best-in-class RF performance with about twice the rangeof other Bluetooth low-energy solutions. Furthermore, TI’s power-management hardware and softwarealgorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energymodes of operation.

TheTI dual-mode Bluetooth stack software is certified and provided royalty free forMCUs and MPUs. The iPod (MFi) protocol issupported by add-on software packages. For more information, seeTI Dual-Mode Bluetooth Stack.Multiple profiles and sample applications are supported including the following:

Serial port profile (SPP)
Advanced audio distribution profile (A2DP)
Audio/video remote control profile (AVRCP)
Hands-free profile (HFP)
Human interface device (HID)
Generic attribute profile (GATT)
Several Bluetooth low energy profiles and services

Features

TI’s Single-Chip Bluetooth Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
Bluetooth 4.2 Component Qualified (Declaration ID: D032801); Compliant up to the HCI Layer
Highly Optimized for Size-Constrained and Low-Cost Designs:
- Single-Ended 50-Ω RF Interface
- PackageFootprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm (VQFNP-MR)
BR and EDR Include:
- Up to Seven Active Devices
- Scatternet: Up toThree Piconets Simultaneously, One as Master and Two as Slaves
- Up to TwoSynchronous Connection Oriented (SCO) Links on the Same Piconet
- Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD),A-Law, μ-Law, Modified Subband Coding (mSBC), andTransparent (Uncoded)
- Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce HostProcessing and Power
- Support of Multiple Bluetooth Profiles With EnhancedQoS
- Low Energy Include:
- Multiple Sniff Instances Tightly Coupled to AchieveMinimum Power Consumption
  - Independent Buffering for Low Energy Allows LargeNumbers of Multiple Connections Without Affecting BR or EDRPerformance
  - Built-In Coexistence and Prioritization Handling for BR, EDR, andLow Energy
  - Capabilities of Link Layer TopologyScatternet—Can Act Concurrently as Peripheral and Central
  - Network Support for up to 10 Devices
  - Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
- Class 1 TX Power up to +12 dBm
- Internal TemperatureDetection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, NoExternal Calibration Required
- Improved Adaptive Frequency Hopping (AFH)Algorithm With Minimum Adaptation Time
- Longer Range, Including Twice the Rangeof Other Low-Energy-Only Solutions
Advanced Power Management for Extended Battery Life and Ease of Design
- On-Chip Power Management, Including Direct Connection toBattery
- Low Power Consumption forActive, Standby, and Scan Bluetooth Modes
- Shutdown and Sleep Modes to Minimize Power Consumption
Physical Interfaces:
- UARTInterface With Support for Maximum Bluetooth Data Rates
  - UART Transport Layer (H4) With Maximum Rate of 4Mbps
  - Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
- Fully Programmable Digital Pulse-Code Modulation(PCM)–Inter-IC Sound (I2S) Codec Interface
Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
CC256x Bluetooth Hardware Evaluation Tool:PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack