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ATSAM3X8EA-CU

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ATSAM3X8EA-CU Overview

ARM® Cortex®-M3 SAM3X Microcontroller IC 32-Bit Single-Core 84MHz 512KB (512K x 8) FLASH 144-BGA (13x13)

ECAD Model

Footprint

ATSAM3X8EA-CU

Features

  • ARM Cortex-M3 revision 2.0 running at up to 84 MHz
  • Memory Protection Unit (MPU)
  • 24-bit SysTick Counter
  • Thumb®-2 instruction set
  • Nested Vector Interrupt Controller
  • 2 x 256Kbytes embedded Flash, 128-bit wide access, memory accelerator, dual bank
  • 100(64+32) Kbytes embedded SRAM with dual banks
  • 16 Kbytes ROM with embedded bootloader routines (UART, USB) and IAP routines
  • Static Memory Controller (SMC): SRAM, NOR, NAND support.
  • NAND Flash controller with 4 Kbytes RAM buffer and ECC
  • External Bus Interface - 16 bits, 8 chip selects, 23-bit address
  • Embedded voltage regulator for single-supply operation
  • POR, BOD and Watchdog for safe reset
  • Quartz or resonator oscillators: 3 to 20 MHz main and optional low power 32.768 kHz for RTC or device clock
  • High precision 8/12 MHz factory trimmed internal RC oscillator with 4 MHz Default Frequency for fast device startup
  • Slow Clock Internal RC oscillator as permanent clock for device clock in low power mode
  • One PLL for device clock and one dedicated PLL for USB 2.0 High Speed Mini Host/Device
  • Temperature Sensor
  • 17 peripheral DMA (PDC) channels and 6-channel central DMA plus dedicated DMA for High-Speed USB Mini Host/Device and Ethernet MAC
  • Sleep, Wait and Backup modes, down to 2.5 μA in Backup mode with RTC, RTT, and GPBR
  • 144-lead LQFP – 20 x 20 mm, pitch 0.5 mm
  • 144-ball LFBGA – 10 x 10 mm, pitch 0.8 mm
  • Industrial (-40° C to +85° C)
  • USB 2.0 Device/Mini Host: 480 Mbps, 4 Kbyte FIFO, up to 10 bidirectional Endpoints, dedicated DMA
  • 4 USARTs (ISO7816, IrDA®, Flow Control, SPI, Manchester and LIN support) and one UART
  • 2 TWI (I2C compatible), up to 6 SPIs, 1 SSC (I2S), 1 HSMCI (SDIO/SD/MMC) with up to 2 slots
  • 9-channel 32-bit Timer Counter (TC) for capture, compare and PWM mode, Quadrature Decoder Logic and 2-bit Gray Up/Down Counter for Stepper Motor
  • 32-bit low-power Real-time Timer (RTT) and low-power Real-time Clock (RTC) with calendar and alarm features
  • 256-bit General Purpose Backup Registers (GPBR)
  • Ethernet MAC 10/100 (EMAC - MII/RMII) with dedicated DMA
  • 2 CAN Controllers with 8 Mailboxes
  • True Random Number Generator (TRNG)
  • 103 I/O lines with external interrupt capability (edge or level sensitivity), debouncing, glitch filtering and on-die Series Resistor Termination
  • Six 32-bit Parallel Input/Output Controllers
  • 16-channel 12-bit 1 msps ADC with differential input mode and programmable gain stage
  • 2-channel 12-bit 1 msps DAC
  • Serial Wire/JTAG Debug Port(SWJ-DP)
  • Debug access to all memories and registers in the system, including Cortex-M4 register bank when the core is running, halted, or held in reset.
  • Serial Wire Debug Port (SW-DP) and Serial Wire JTAG Debug Port (SWJ-DP) debug access.
  • Flash Patch and Breakpoint (FPB) unit for implementing breakpoints and code patches.
  • Data Watchpoint and Trace (DWT) unit for implementing watchpoints, data tracing, and system profiling.
  • Instrumentation Trace Macrocell (ITM) for support of printf style debugging.
  • IEEE1149.1 JTAG Boundary-scan on all digital pins.
  • ASF-Atmel software Framework – SAM software development framework
  • Integrated in the Atmel Studio IDE with a graphical user interface or available as standalone for GCC, IAR compilers.
  • DMA support, Interrupt handlers Driver support
  • USB, TCP/IP, Wi-Fi and Bluetooth, Numerous USB classes, DHCP and Wi-Fi encryption Stacks
  • RTOS integration, FreeRTOS is a core component

Applications

SAM3X

Specifications

  • Core Processor ARM Cortex M3

  • DigiKey Programmable Not Verified

  • Speed 84MHz

  • Operating Temperature -40℃ ~ 85℃ (TA)

  • Program Memory Type FLASH

  • RAM Size 100K x 8

  • Number of I/O 103

  • Peripherals Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT

  • Mounting Type Surface Mount

  • Product Status Active

  • Oscillator Type Internal

  • Supplier Device Package 144-BGA (13x13)

  • EEPROM Size -

  • Series SAM3X

  • Package / Case 144-LFBGA

  • Core Size 32-Bit

  • Mfr Microchip Technology

  • Connectivity CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, Memory Card, SPI, SSC, UART/USART, USB

  • Program Memory Size 512KB (512K x 8)

  • Data Converters A/D 16x12b; D/A 2x12b

  • Package Tray

  • Voltage - Supply (Vcc/Vdd) 1.62V ~ 3.6V

  • Base Product Number ATSAM3X

Circuit Diagram

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