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Xilinx

XC4VSX25-11FFG668I

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XC4VSX25-11FFG668I Overview

Combining Advanced Silicon Modular Block (ASMBL™) architecture with a wide variety of flexible features, the Virtex®-4 family from Xilinx greatly enhances programmable logic design capabilities, making it a powerful alternative to ASIC technology. Virtex-4 FPGAs comprise three platform families—LX, FX, and SX—offering multiple feature choices and combinations to address all complex applications. The wide array of Virtex-4 FPGA hard-IP core blocks includes the PowerPC® processors (with a new APU interface), tri-mode Ethernet MACs, 622 Mb/s to 6.5 Gb/s serial transceivers, dedicated DSP slices, high-speed clock management circuitry, and source-synchronous interface blocks. The basic Virtex-4 FPGA building blocks are enhancements of thouse found in the popular Virtex, Virtex-E, Virtex-II, Virtex-II Pro, and Virtex-II Pro X product families, so previous-generation designs are upward compatible. Virtex-4 devices are produced on a state-of-the-art 90 nm copper process using 300 mm (12-inch) wafer technology.

Features

  • Three Families — LX/SX/FX
    • Virtex-4 LX: High-performance logic applications solution
    • Virtex-4 SX: High-performance solution for digital signal processing (DSP) applications
    • Virtex-4 FX: High-performance, full-featured solution for embedded platform applications
  • Xesium™ Clock Technology
    • Digital clock manager (DCM) blocks
    • Additional phase-matched clock dividers (PMCD)
    • Differential global clocks
  • XtremeDSP™ Slice
    • 18 x 18, two’s complement, signed Multiplier
    • Optional pipeline stages
    • Built-in Accumulator (48-bit) and Adder/Subtracter
  • Smart RAM Memory Hierarchy
    • Distributed RAM
    • Dual-port 18-Kbit RAM blocks
      • Optional pipeline stages
      • Optional programmable FIFO logic automatically remaps RAM signals as FIFO signals
    • High-speed memory interface supports DDR and DDR-2 SDRAM, QDR-II, and RLDRAM-II.
  • SelectIO™ Technology
    • 1.5V to 3.3V I/O operation
    • Built-in ChipSync™ source-synchronous technology
    • Digitally controlled impedance (DCI) active termination
    • Fine grained I/O banking (configuration in one bank)
  • Flexible Logic Resources
  • Secure Chip AES Bitstream Encryption
  • 90 nm Copper CMOS Process
  • 1.2V Core Voltage
  • Flip-Chip Packaging including Pb-Free Package Choices
  • RocketIO™ 622 Mb/s to 6.5 Gb/s Multi-Gigabit Transceiver (MGT) [FX only]
  • IBM PowerPC RISC Processor Core [FX only]
    • PowerPC 405 (PPC405) Core
    • Auxiliary Processor Unit Interface (User Coprocessor)
  • Multiple Tri-Mode Ethernet MACs [FX only]

Specifications

  • Operating Temperature -40℃ ~ 100℃ (TJ)

  • Package / Case 668-BBGA, FCBGA

  • Voltage - Supply 1.14V ~ 1.26V

  • Number of LABs/CLBs 2560

  • Total RAM Bits 2359296

  • Number of I/O 320

  • Number of Logic Elements/Cells 23040

  • Mounting Type Surface Mount

  • Supplier Device Package 668-FCBGA (27x27)

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